Group-IV 2D materials beyond graphene on nonmetal substrates: Challenges, recent progress, and future perspectives

Abstract

The family of two-dimensional materials has been expanding rapidly over the last few years. Within it, a special place is occupied by silicene, germanene, and stanene due to their inherent compatibility with the existing semiconductor technology (notably for the case of silicene and germanene). Although obtaining them is not trivial due to the lack of layered bulk counterparts from which they could be mechanically exfoliated, they have been recently synthesized on a number of metallic substrates. The remarkable interaction between metals and these puckered materials, however, strongly modifies their intrinsic electronic properties, and also jeopardizes their integration into functional devices. In this context, first experimental efforts are now being devoted to the synthesis of silicene, germanene, and stanene on nonmetal substrates. Here, we review these pioneering works, present the ongoing debate, analyze, and discuss the major technical challenges and finally suggest possible novel solutions worth exploring.

Numerical investigation on the electronic components' cooling for different coolants by finite element method

“…The electronic chip (made of silicon) is dissipating heat at a rate of 5 W/m 3 , and three fins made of aluminum have been attached to it. In reference [29], readers can find the material's properties of aluminum and silicon used in the numerical simulation.…”

“…Ambient temperature is taken as 293 K. Q v is the dissipated power from the electronic chip that is 5 W/m 3 , A is the surface area exposed to the surrounding, h is the convective heat transfer coefficient, is the surface emissivity, and denotes the Stefan–Boltzmann constant throughout the finite element method (FEM) region. In references [29] and [30], readers can find the details and values of the parameters used in the above equations. The convective heat transfer coefficient, h , is calculated by an empirical relation, that is: where v is the relative velocity between the coolant and the chamber.…”

“…In references [29] and [31], readers can find the thermal and hydraulic parameters of the coolants considered in the present investigation. It is worth mentioning that the maximum temperature is recorded in the electronic chip domain, as expected.…”

Epitaxial Growth of Main Group Monoelemental 2D Materials

“…[ 147a ] Growing on nonmetallic substrates is of great interest to gain insight into the prominent properties of stanene. [ 148 ] PbTe(111) is an insulator (≈0.3 eV) with a lattice constant close to that of stanene. It can be prepared by MBE on Si(111) with a buffer layer of Bi 2 Te 3 .…”

Supramolecular assemblies tailored by dipyridyl-1,2-4-thiadiazoles: influence of the building blocks in the predictability of the final network

“…The seek in the rational and pre-determined design of crystalline materials has attracted the scientific interest over the past decades. [1][2][3] The developments in the intriguing field of reticular chemistry allowed chemists to obtain cutting-edge materials such as Charge-Transfer and Proton Transfer compounds, [4][5][6] Coordination Polymers (CPs), [7] Metal Organic Frameworks (MOFs), [8] and Covalent-Organic Frameworks (COFs) [9] that have been employed in a multitude of applications as different as carbon dioxide capture and conversion, [10] gas storage, [11] catalysis, [12] sensing [13] and photonics. [14,15] Due to the strong dependence of the macroscopic properties of these materials on the reticular scaffold, it is mandatory to understand how the resulting network can be predicted from a meticulous design of the constituent building blocks.…”