Ge with a quasi-direct band gap can be realized by strain engineering, alloying with Sn or ultra-high n-type doping. In this paper, we use all three approaches together -strain engineering, Sn alloying and n-type doping to fabricate direct band gap GeSn alloys. The heavily-doped n-type GeSn was realized using a CMOS-compatible non-equilibrium material processing. P is used to form a highly-doped n-type GeSn layers and to modify the lattice parameter of GeSn:P alloys. The strain engineering in heavily P-doped GeSn films is confirmed by X-ray diffraction and micro-Raman spectroscopy. The change of the band gap in GeSn:P alloy as a function of P concentration is theoretically predicted using density functional theory and experimentally verified by near-infrared spectroscopic ellipsometry.According to the shift of the absorption edge it is shown that for an electron concentration above 1×10 20 cm -3 the band gap renormalization is partially compensated by the Burstein-Moss effect. These results indicate that Ge-based materials have a large potential for the nearinfrared optoelectronic devices, fully compatible with CMOS technology.