“…To this aim, both different Zn doping levels in the range 1 × 10 19 < [Zn] < 1 × 10 20 cm −3 , and time‐temperature annealing conditions, from 0 to 4 hours and from 600° to 660 °C, have been investigated with the purpose to control the depth of the junction. However, surprisingly, the penetration depth of the Zn acceptors resulted to be in the range of 50–100 nm, much lower than the typical values obtained by the common diffusion methods applied in TPV devices and practically independent of the post grown annealing processes, as shown by secondary ion mass spectroscopy (SIMS) analysis . In addition, the p‐n junction resulted located more deeply with respect to the Zn diffusion front, as pointed out by electron beam induced current (EBIC) investigation .…”