With the rapid development of modern aerospace, national security technology and processes, thin films are widely used in fields such as semiconductors, optics, electronics, and aerospace. The precise control and measurement of their thickness have a crucial impact on the performance and quality of products, as the film preparation process, real-time feedback, and post film performance testing are all closely related to thin film detection technology. At present, this is also a widely recognized research direction. Traditional contact detection methods typically require expensive equipment and complex operations and may cause scratches and damage to the tested surface, making them unsuitable for practical applications. Therefore, studying a simple, fast, and accurate method for detecting thin film thickness is of great significance. The thin film detection method based on optical principles has become an important means in the field of detection and processing both domestically and internationally. In this paper, a fast measurement method for multilayer film thickness based on wide spectral interference principle is proposed, which is a very promising method. This technology utilizes changes in interference fringes to measure the thickness of thin films, which has the advantages of non-contact, high-precision, and high-resolution. The feasibility and accuracy of proposed method have been verified through theoretical analysis and simulation in this article.