Solid-solution Nb-O films containing up to 50 atom % oxygen, prepared by magnetron sputtering, were used to investigate the influence of the oxygen on field crystallization during anodizing at 100 V in 0.1 mol dm −3 ammonium pentaborate electrolyte at 333 K. The findings reveal that field crystallization is hindered dramatically by addition of 20 atom % oxygen to the substrate, while no crystallization occurs for a Nb-50 atom % O substrate. Prior thermal treatment accelerates field crystallization of niobium, but not the Nb-50 atom % O substrate. The thermal treatment is considered to promote generation of precursor sites for crystal nucleation. However, sufficient oxygen in the substrate may restrict precursor development and/or reduce the compressive stresses in the amorphous anodic niobia that can facilitate crystal growth. Niobium is a potential alternative material to tantalum for electrolytic capacitors due to its many attractive properties 1 and its relatively high natural abundance. However, niobium capacitors are more susceptible to field crystallization during both growth of the anodic oxide dielectric and packaging of capacitors. Field crystallization in niobium and tantalum leads to degradation of the initial amorphous oxide, involving cracking and peeling due to growth of crystalline oxide, 2 which increases the leakage current. The effects are enhanced at increased anodizing temperatures and forming voltages.2-4 Inclusions 5,6 and roughness, especially convex surfaces, of the substrate assist crystal nucleation. 7,8 Recent studies using flat, inclusion-free, magnetron-sputtered niobium suggested nucleation is associated with precursor sites in the original, air-formed film, while incorporation of foreign species from the electrolyte or from the substrate at precursor regions can hinder nucleation.9 Other investigations indicate an enhanced susceptibility to field crystallization due to oxygen impurity in the substrate. 5,10,6,11 Oxide precipitates, possibly at grain boundaries, may be involved, although the detailed processes are not well understood. Here, the influence of oxygen in the substrate is examined on field crystallization of the anodic niobia.
ExperimentalNiobium and Nb-͑20 and 50͒ atom % O films were deposited by sputtering 99.9% niobium in either argon or a mixture of argon and oxygen at ϳ0.1 Pa using magnetron sputtering enhanced with a radio frequency plasma source to increase the plasma density. Three types of flat substrate were employed: glass plates, silicon wafers, and electropolished and anodized aluminum sheets. Subsequent thermal treatment of the deposited films, either in air at 523-623 K for 1.8 ks or in vacuum ͑ϳ10−5 Pa͒ at 923 K, was employed selectively. Structures of the deposits were determined by X-ray diffraction ͑XRD͒ ͑Rigaku RINT 2000͒ using Cu K␣ radiation, with patterns obtained in an ␣−2 ͑␣ = 1°͒ mode.The films were anodized at 50 A m −2 to 100 V with current decay in stirred 0.1 mol dm −3 ammonium pentaborate electrolyte at 333 K. A platinum sheet was used as a...