2015
DOI: 10.1116/1.4922341
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Growth of c-axis oriented AlN thin films on titanium alloy substrate by middle frequency magnetron sputtering

Abstract: A two-step deposition process was developed to deposit highly c-axis oriented AlN thin films on titanium alloy substrates by middle-frequency magnetron sputtering. Smooth AlN seed layer was first prepared on rough titanium alloy substrate at the first step. Then, c-axis oriented AlN films with small grain size were deposited at the second step. The effects of the growth time at the first and second step on the microstructure and the c-axis orientation of the AlN films were studied. It was found that the c-axis… Show more

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Cited by 8 publications
(7 citation statements)
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“…From the above results, it can be concluded that the quality of the AlN film is an important factor in affecting the performance of the SAW devices. To explore the effects of the FWHM of the AlN films on the characteristics of the AlN/TC4 SAW devices, we prepared AlN films on the TC4 substrate with different FWHMs by changing the ratio of depositing time at the first and second steps, while the total thickness was fixed to 2.5 μm [ 14 ]. The dependence of the Q-factor and k 2 on the FWHM of AlN films is presented in Figure 9 .…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…From the above results, it can be concluded that the quality of the AlN film is an important factor in affecting the performance of the SAW devices. To explore the effects of the FWHM of the AlN films on the characteristics of the AlN/TC4 SAW devices, we prepared AlN films on the TC4 substrate with different FWHMs by changing the ratio of depositing time at the first and second steps, while the total thickness was fixed to 2.5 μm [ 14 ]. The dependence of the Q-factor and k 2 on the FWHM of AlN films is presented in Figure 9 .…”
Section: Resultsmentioning
confidence: 99%
“…A two-step deposition process was used to deposit AlN films onto the TC4 substrate. The growth process is studied in [ 14 ] in detail. By controlling the deposition time, the thickness of the AlN film was adjusted from 1.5 μm to 3.5 μm, yielding a t AlN /λ from 0.0625 to 0.1458.…”
Section: Fabricationmentioning
confidence: 99%
“…High purity N 2 (99.999%) and Ar (99.999%) were injected into the chamber. A so-called two-step deposition technique [ 13 ] was used. Firstly, the AlN films were deposited for 30 min and the substrates temperature was fixed at 400 °C.…”
Section: Methodsmentioning
confidence: 99%
“…The total sputtering time was 2 h and the thickness of the AlN films was about 3 μm. This two-step deposition process was proposed in reference [ 13 ] in detail. Si (100) substrates were also used to deposit AlN films in every sputtering process for comparison.…”
Section: Methodsmentioning
confidence: 99%
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