“…1,2 This scheme allows one to avoid crosscontamination problems as expected, for instance, in the case of combination with SiGe-or Ge-based p-channels. In particular, the quantum-well ͑QW͒ channel devices with a highpermittivity ͑high-͒ oxide gate insulator are expected to offer significant gains.…”
From internal photoemission and photoconductivity measurements at the (100)GaSb/Al2O3 interface, the semiconductor valence band is found to be 3.05±0.10 eV below the oxide conduction band. This band alignment corresponds to conduction and valence band offsets of 2.3±0.10 and 3.05±0.15 eV, respectively. These results indicate that the valence band in GaSb lies energetically well above the valence band in InxGa1−xAs (0≤x≤0.53) or InP, suggesting the possibility of fabrication of hole quantum-well channel structures.
“…1,2 This scheme allows one to avoid crosscontamination problems as expected, for instance, in the case of combination with SiGe-or Ge-based p-channels. In particular, the quantum-well ͑QW͒ channel devices with a highpermittivity ͑high-͒ oxide gate insulator are expected to offer significant gains.…”
From internal photoemission and photoconductivity measurements at the (100)GaSb/Al2O3 interface, the semiconductor valence band is found to be 3.05±0.10 eV below the oxide conduction band. This band alignment corresponds to conduction and valence band offsets of 2.3±0.10 and 3.05±0.15 eV, respectively. These results indicate that the valence band in GaSb lies energetically well above the valence band in InxGa1−xAs (0≤x≤0.53) or InP, suggesting the possibility of fabrication of hole quantum-well channel structures.
“…3 Recently, InAs/ Al y Ga 1−y Sb heterojunction tunnel field effect transistors ͑H-TFETs͒ have been proposed for low-power high-performance applications. 4 Integrating a high quality dielectric is key to demonstrating a scalable metal-oxide-semiconductor QWFET ͑MOS-QWFET͒ or H-TFET architecture for low-power logic applications.…”
A.; Madan, H. S.; Kirk, A. P.; et al., "Fermi level unpinning of GaSb (100) using plasma enhanced atomic layer deposition of Al2O3," Appl. Phys. Lett. 97, 143502 (2010); http:// dx
“…A significant difference between this structure and our earlier HEMTs 18,19 is that the InAlSb upper barrier replaces InAlAs and AlSb. 20 One reason for this change was to avoid the use of pure AlSb, because Miya et al showed that replacing 20-40% of the Al with Ga in AlGaAsSb greatly reduces oxidation. 21 The x-ray diffraction data for sample Q is shown in Fig.…”
Heterostructures for InAs-channel high-electron-mobility transistors (HEMTs) were investigated. Reactive AlSb buffer and barrier layers were replaced by more stable Al 0.7 Ga 0.3 Sb and In 0.2 Al 0.8 Sb alloys. The distance between the gate and the channel was reduced to 7-13 nm to allow good aspect ratios for very short gate lengths. In addition, n + -InAs caps were successfully deposited on the In 0.2 Al 0.8 Sb upper barrier allowing for low sheet resistance with relatively low sheet carrier density in the channel. These advances are expected to result in InAs-channel HEMTs with enhanced microwave performance and better reliability.
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