Growth of the nano-phase intermetallic compounds and its effect on mechanical behavior of Au80Sn20/CrMnFeCoNi solder joints during isothermal aging

Liu, Xiao; Chen, Baishan; Wu, Siyuan; Ma, Yunzhu; Tang, Shibo; Wu, Zhenggang; Huang, Yufeng; Liu, Wensheng

doi:10.1016/j.jallcom.2020.157823

Cited by 4 publications

(1 citation statement)

References 36 publications

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“…Meanwhile, the Au80Sn20-based joints exhibited significantly declined shear strength from 67.23 MPa to 17.34 MPa after aging at 200 ℃ for 360h due to the continuous formation of intermetallic compounds, and almost failed at above 250 ℃, which cannot fully meet the requirement of power-electronics [11]. Hence, the transient liquid phase (TLP) bonding has been proposed to complete soldering at relatively low temperatures to form full-IMCs joints with higher remelting temperatures [12]. Note that the extensive heating duration required to create full-IMC structures resulted in multiple hours of annealing before achieving a thermodynamically stable joint [13][14][15].…”

Section: Introductionmentioning

confidence: 99%

High-Temperature Reliability of Nano-Ag Sintered Joints on Ag-Plated Cu Substrates

Xiaoting,

He,

Peng

et al. 2024

J. Phys.: Conf. Ser.

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As an emerging lead-free packaging interconnect material, Nano-Ag paste exhibits superior high-temperature mechanical, electrical, and thermal properties. It can meet the stringent high-temperature and high-density packaging requirements of future high-power semiconductor devices and is garnering widespread attention. However, research on the high-temperature reliability of sintered joints remains rather limited. In this study, we fabricated high-strength hot-press sintered nano-Ag joints using a hot-press sintering process. These joints underwent aging at high temperatures of 200°C and 300°C, yielding insights into the variations in mechanical properties at different temperatures. The reasons behind joint failure were analyzed by investigating the evolution of joint microstructures and fracture surfaces. The results indicate that even after extended aging at 200°C, the joint strength can still be maintained at 176 MPa. However, after aging for over 100 hours at 300°C, the joint fails. The growth of Cu oxides was observed within the joint microstructure, which constitutes the primary cause of joint failure at 300°C.

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