2013
DOI: 10.1016/j.jcrysgro.2013.05.009
|View full text |Cite
|
Sign up to set email alerts
|

Growth of thick InGaN films with entire alloy composition using droplet elimination by radical-beam irradiation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
24
0

Year Published

2014
2014
2020
2020

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 28 publications
(24 citation statements)
references
References 19 publications
0
24
0
Order By: Relevance
“…In order to take advantage of both metal-rich and N-rich conditions, several modulated growth methods have been studied [10,11]. Metal-modulated epitaxy (MME), a growth technique that uses constant N flux, shuttered Ga and In fluxes under metal-rich conditions, and extremely low substrate temperatures (400-450°C), has enabled the growth of InGaN films throughout the miscibility gap [12,13].…”
Section: Introductionmentioning
confidence: 99%
“…In order to take advantage of both metal-rich and N-rich conditions, several modulated growth methods have been studied [10,11]. Metal-modulated epitaxy (MME), a growth technique that uses constant N flux, shuttered Ga and In fluxes under metal-rich conditions, and extremely low substrate temperatures (400-450°C), has enabled the growth of InGaN films throughout the miscibility gap [12,13].…”
Section: Introductionmentioning
confidence: 99%
“…Gacevic et al 6 presented a growth diagram of InGaN with In content up to 50% and identified an intermediate metal rich regime, with 1À2 monolayer (ML) thick In coverage, which provided best InGaN quality in terms of surface morphology. On the other hand, Yamaguchi et al 7 showed the growth of thick and uniform In x Ga 1-x N films with the entire alloy composition range (0.2 x 1) using the droplet elimination radical-beam irradiation method. In this method, the impinging Ga and N fluxes remain constant, and the In flux is modulated, alternating growth under In excess and interruptions of the In flux to consume the excess accumulated on the surface.…”
mentioning
confidence: 99%
“…For the growth of the InGaN layers, the Ga flux was varied between 4.5 10 14 and 6. . All the InGaN layers described in this study were grown using the advanced-DERI method [11] and [12] at a substrate temperature of 550 ºC.…”
Section: Methodsmentioning
confidence: 99%