Guidelines for performing storage modulus measurements using the TA Instruments DMA 2980 three-point bend mode II. Contact stresses and machine compliance

Shao, Qing; Lee‐Sullivan, Pearl

doi:10.1016/s0142-9418(98)00084-1

Cited by 22 publications

(12 citation statements)

References 1 publication

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“…Ideally the storage modulus is the same as the Young's modulus and other researchers' DMA modulus measurements have matched quasi‐static modulus values for similar amorphous glassy polymers . However, they have noted that certain DMA strains and sample dimensions result in incongruous results supporting the hypothesis of this paper on the criticality of sample dimensions and test conditions to obtain accurate results. The quasi‐static flexural, rather than the tensile, modulus was chosen as a reference due to the DMA testing being performed in a bending mode.…”

Section: Introductionsupporting

confidence: 59%

“…While TTS generally spans decades of frequencies, even a minor increase in strain rate will cause an increase in modulus, such as that seen by Lee‐Sullivan and Dykeman. As the increases in amplitude were minor, so were the modulus increases, with the results remaining very similar to the reference modulus . If the displacement is too small; however, the test may not be in bending mode but rather a mix of bending and torsion as the sample “settles” on the clamp rather than bends, resulting in incorrect modulus values .…”

Section: Introductionmentioning

confidence: 91%

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DMA testing of epoxy resins: The importance of dimensions

McAninch

Palmese

Lenhart

et al. 2015

Polymer Engineering & Sci

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Dynamic mechanical analysis is commonly used to characterize thermoset polymers at temperatures ranging from well below to well above their glass transition temperatures. Many sample fixtures are available; however, the best clamp and best sample dimensions for a given material are not often readily apparent. Five different epoxy amine networks with glass transitions spanning over 1008C were characterized on three-point bending, dual cantilever, and single cantilever clamps with both constant thickness and constant span-to-thickness. Glassy modulus values were accurately measured on all clamps provided span-to-thickness ratios >10 were maintained. Thermal expansion and decreasing sample stiffness with increasing temperature greatly affect measurements in the rubbery region resulting in single cantilever clamps being best suited to measure rubbery data.

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Section: Introductionsupporting

confidence: 59%

Section: Introductionmentioning

confidence: 91%

DMA testing of epoxy resins: The importance of dimensions

McAninch

Palmese

Lenhart

et al. 2015

Polymer Engineering & Sci

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show abstract

“…The onset is clearly identified in a bending setup and is chosen because it relates to the point where the material begins to respond elastically to the imposed loading. In A bending (or shear) loading of a composite material is excellent for studying changes or effects related to the matrix constituent [27][28][29][30][31]. However, bending loading may introduce a multiple stress state and a bending stress varying through the thickness, which is not ideal for determination of the in-plane Young's modulus of the material.…”

Section: Dynamic Mechanical Analysismentioning

confidence: 99%

Thermo-mechanical characterisation of in-plane properties for CSM E-glass epoxy polymer composite materials – Part 2: Young's modulus

2013

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“…DMA provides information about the motion changes of the chain as the temperature changes. With the use of DMA, we were able to measure the complex modulus (ε*), elastic modulus (ε′), and loss modulus (ε″), which was calculated from the response of the PI sample to a sine wave …”

Section: Resultsmentioning

confidence: 99%

The effect of the ring opening polymerization and chain spacing on the coefficient of thermal expansion and modulus of polyimide

Yoo

Kim

Jang³

et al. 2015

J of Applied Polymer Sci

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The features of norbornene (NE) cross-linked polyimide (PI) were investigated as the ratio of the norbornene monomer was varied. The coefficient of thermal expansion and modulus are important parameters of materials used in the microelectronic industry. Therefore, in this study, 5-norbornene-2, 3-dicarboxylic acid (NE) was introduced as a crosslinking agent to increase the thermal stability at elevated temperatures. 4,4 0 -Benzophenonetetracarboxylic dianhydride was utilized as a dianhydride and 4,4 0 -diaminodiphenyl ether was introduced as a diamine monomer. By changing the ratio of each monomer, we were able to control the spacing of the chain and ring opening polymerization, which resulted in improved properties. Each sample was thermally cured which led to a ring opening mechanism of the norbornene through the reverse Diels-Alder reaction. Thermal mechanical analysis was utilized to determine the coefficient of thermal expansion and dynamic mechanical analysis was used to determine the storage modulus (e 0 ) and loss modulus (e 00 ) of the PI film.

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Guidelines for performing storage modulus measurements using the TA Instruments DMA 2980 three-point bend mode II. Contact stresses and machine compliance

Cited by 22 publications

References 1 publication

DMA testing of epoxy resins: The importance of dimensions

DMA testing of epoxy resins: The importance of dimensions

Thermo-mechanical characterisation of in-plane properties for CSM E-glass epoxy polymer composite materials – Part 2: Young's modulus

The effect of the ring opening polymerization and chain spacing on the coefficient of thermal expansion and modulus of polyimide

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