To determine the thermal characteristics of linear and crosslinked polyimides (PIs), BTDA, ODPA, and 6FDA were used to synthesize polyimides. Thermal degradation temperature and glass transition temperature of the resulting PIs were measured using thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). To measure the change in modulus and coefficient of thermal expansion (CTE) depending on dianhydride structure, a dynamic mechanical analyzer (DMA) and thermo-mechanical analyzer (TMA) were used. The thermal degradation and glass transition temperature properties of linear PIs varied according to whether the linear chain adopted a bulky or flexible structure. Dynamic modulus and thermal expansion values of linear polyimides also showed good agreement with the TGA and DSC results. As we expected, linear polyimide with bulky 6FDA groups showed better thermal behavior than the flexible polyimides. Crosslinked polyimide nadic end-capped (norbornene) with a bulky dianhydride group had a lower thermal degradation temperature and higher CTE than flexible BTDA and ODPA polyimides. Our results indicate that the mobility of the dianhydride group affects the thermal behaviors of linear and crosslinked polyimides in different ways.

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In this contribution, composite membranes (CM-D and CM-S) of 2,5-polybenzimidazole (PBI) were synthesized by adding inorganic heteropoly acids (IHA-D and IHA-S). IHA-D and IHA-S were synthesized by condensation reaction of silicotungstic acid with tetraethyl orthosilicate (TEOS) in the absence and presence of mesoporous silica (SiO2), respectively. The synthesized composites were structurally and morphologically characterized and further investigated the functional relationships between the materials structure and proton conductivity. The proton conductivity as well as thermal stability was found to be higher for composite membranes which suggest that both properties are highly contingent on mesoporous silica. The composite membrane with mesoporous silica shows high thermal properties and proton conductivity. IHA-D shows proton conductivity of almost1.48×10-1 Scm−1while IHA-S exhibited2.06×10-1 Scm−1in nonhumidity imposing condition (150°C) which is higher than pure PBI. Thus introduction of inorganic heteropoly acid to PBI is functionally preferable as it results in increase of ion conductivity of PBI and can be better candidates for high temperature PEMFC.

The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε') and loss modulus (ε'') were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature.

In this study, poly(amide-imide)s are synthesized for electronic materials by adding amide groups into polyimide. As it is expected, poly(amide-imide) shows an amorphous structure with a lower glass transition temperature and residual stress than the neat polyimide due to the high steric hindrance of the amide group. Also, the modifi cation to the polyimide structure leads to higher transmittance and enhances colorless properties. Consequently, successful synthesis of poly(amide-imide) s is demonstrated which has wide applicability in the electronic industries due to their low glass transition temperature. It is expected that semiconductor and integrated circuit products can be manufactured utilizing poly(amide-imide)s with high reliability and a low chance of cracking due to their lower residual stress. Furthermore, it envisioned that the improved optical properties of poly(amide-imide) materials will allow for their applications in transparent displays and coating products.