Hall–Petch Relations of Severely Deformed Cu, Ni, and Cu–Ni Alloys: Analysis of the Dislocation Blockage Strength of Deformation‐Modified Grain Boundaries

Emeis, Friederike; Peterlechner, Martin; Wilde, Gerhard

doi:10.1002/adem.201900429

Cited by 12 publications

(3 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Based on the TEM results, which showed even finer grains, we propose that another factor, i.e., the inverse Hall-Petch effect, may to some extent contribute to the deterioration of the mechanical properties. Several researchers [25][26][27][28][29][30] have observed and reported the inverse Hall-Petch effect in Cu. According to these publications, the Hall-Petch relation breaks down in submicron grain-sized materials.…”

Section: Discussionmentioning

confidence: 99%

A Study of the Metallurgical and Mechanical Properties of Friction-Stir-Processed Cu

Regev

Spigarelli

2021

Metals

View full text Add to dashboard Cite

Friction stir processing (FSP), a severe plastic deformation process, was applied on pure Cu to obtain a stir zone with a very fine grain size. Yet, when FSP is used, the stir zone is as wide as the diameter of the shoulder at the upper surface of the weld and markedly narrower near its opposite surface. This property, as well as the differences between the advancing side and the retreating side, makes it impossible to obtain a uniform cross-section as far as the microstructure and mechanical properties are concerned. For these reasons, a new approach is proposed in which the material was processed on both sides, thus yielding a wider, rectangular and more homogenous stir zone from which all the specimens were machined out. Processing the material from both sides eliminated any microstructural difference between the upper and the lower side, at least within the gauge length’s cross-section of the creep specimens. Although grain refinement was detected, the mechanical properties of the friction-stir-processed (FSP’ed) material are inferior relative to those of the parent material. The TEM study reported in the current paper revealed the existence of nanosized grains in the FSP’ed material due to dynamic recrystallization (DRX) occurring during the processing stage. Because both X-ray inspection and fractography showed that the FSP’ed material was free of defects, the material may not comply with the Hall–Petch relation due to lower dislocation density caused by XRD occurring during FSP. The inverse Hall–Petch effect may also be considered as an assistive mechanism in mechanical property deterioration.

show abstract

Section: Discussionmentioning

confidence: 99%

A Study of the Metallurgical and Mechanical Properties of Friction-Stir-Processed Cu

Regev

Spigarelli

2021

Metals

View full text Add to dashboard Cite

show abstract

“…The yield strength of oxygen-free copper wire annealed at 210 C for 8 h was 82.995 MPa, so the value of k could be calculated as 129.84 MPa μm À1/2 according to Equation (3). Some studies showed that the k value is between 110 and 160 MPa μm À1/2 , [20][21][22][23] thus the calculated value of k can be considered credible. According to the calculated value of k, the grain strengthening values of oxygen-free copper wires annealing at different temperatures were quantitatively expressed, and the grain boundary strengthening values were is listed in Figure 10.…”

Section: Grain Boundary Strengthening Of Annealed Oxygen-free Copper ...mentioning

confidence: 99%

Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires

Sun

Hou

et al. 2022

Adv Eng Mater

View full text Add to dashboard Cite

In the process of electric power transmission, the defects in the copper wire interact with the electrons which results in a thermal effect, accordingly, causing the changes of microstructure and properties of the copper wire. Herein, the evolution of microstructure, strength, and electrical conductivity of the oxygen‐free copper wires annealed at different temperatures is investigated. In addition, the effects of various microstructures on strength and electrical conductivity are quantitatively revealed. In the low‐temperature region (80–150 °C), dislocation recovery is the main reason for the decrease in strength; while, the increase in electrical conductivity is mainly due to the decrease in dislocation density and the transformation of grain boundary from nonequilibrium state to equilibrium state. In the high‐temperature region (above 210 °C), the strength loss is mainly related to the increasing recrystallized grain size and the disappearance of dislocations in the recrystallized region. The increase in electrical conductivity is mainly attributed to the significant decrease in grain boundary density and the further recovery of dislocations.

show abstract

“…Further increase in the number of ECAP pass has a negligible impact on the increase in hardness value. 36…”

Section: Mechanical Characterizationmentioning

confidence: 99%

Investigation of microstructure and mechanical properties of Cu-Ni alloy processed by equal channel angular pressing

Sachin

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

View full text Add to dashboard Cite

The Copper-Nickel alloy, C70600, was subjected to severe plastic deformation by the equal channel angular pressing (ECAP) technique. The material was pressed at room temperature along route BC for eight passes. Microstructural analysis and mechanical characterization of the material were done for each of the ECAP pass samples. The initial homogenized material having equiaxial grains of average grain size 75 µm was reduced to 20 µm after eight ECAP passes. Electron backscatter diffraction data presented an increase in low angle grain boundaries with an increase in the number of ECAP passes. Initially, the ultimate tensile strength and the hardness increased by 56% and 94% respectively. After the fifth ECAP pass, a drastic reduction in ultimate tensile strength and ductility was witnessed. Hardness value remained constant after the fifth ECAP pass. Fractography analysis indicate the ductile mode of fracture with reduced dimple size at higher ECAP passes.

show abstract

Hall–Petch Relations of Severely Deformed Cu, Ni, and Cu–Ni Alloys: Analysis of the Dislocation Blockage Strength of Deformation‐Modified Grain Boundaries

Cited by 12 publications

References 29 publications

A Study of the Metallurgical and Mechanical Properties of Friction-Stir-Processed Cu

A Study of the Metallurgical and Mechanical Properties of Friction-Stir-Processed Cu

Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen‐Free Copper Wires

Investigation of microstructure and mechanical properties of Cu-Ni alloy processed by equal channel angular pressing

Contact Info

Product

Resources

About