1971
DOI: 10.1149/1.2408101
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Handbook of Thin Film Technology

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Cited by 810 publications
(569 citation statements)
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“…But a decrease of T substrate <500° C leads to a reduction of the device efficiency because of a less compact structure and the decrease of grain size. This is likely due to a lower surface mobility during the growth at lower temperatures [12] and indicates the importance of a reasonably high T substrate to maintain a sufficient quality of the absorber. So, it is expected to achieve enhanced efficiencies for solar cells on Mo combining a high T substrate (>535° C) and an optimum Cu excess during the process ((Cu/Ga)e 2 ∼1.3).…”
Section: Resultsmentioning
confidence: 99%
“…But a decrease of T substrate <500° C leads to a reduction of the device efficiency because of a less compact structure and the decrease of grain size. This is likely due to a lower surface mobility during the growth at lower temperatures [12] and indicates the importance of a reasonably high T substrate to maintain a sufficient quality of the absorber. So, it is expected to achieve enhanced efficiencies for solar cells on Mo combining a high T substrate (>535° C) and an optimum Cu excess during the process ((Cu/Ga)e 2 ∼1.3).…”
Section: Resultsmentioning
confidence: 99%
“…The constant e is estimated using expression [12] e = n 2 where n is the refractive index of the prepared glass obtained from the optical re ectance data of each composition [13]. Table 1 lists the values of n, e, β t,s and β t,p f for each prepared composition.…”
Section: Resultsmentioning
confidence: 99%
“…Table 1 lists the values of n, e, β t,s and β t,p f for each prepared composition. The slopes m s of the curves of Figure 2 are used to obtain the experimental values of β t,s using the relation [12].…”
Section: Resultsmentioning
confidence: 99%
“…22) From Eq. (2), the sputtered atoms undergo a large number of collisions when the sputtering pressure is high and have a higher probability of agglomeration.…”
Section: Effects Of Sputtering Pressure On the Properties Of Batiomentioning
confidence: 99%