2012
DOI: 10.1016/j.jcrysgro.2011.12.019
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Hardness control for improvement of dislocation reduction in HVPE-grown freestanding GaN substrates

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Cited by 18 publications
(19 citation statements)
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“…The GaN wafers were grown using hypride vapor phase epitaxy (HVPE) technique. The details of growth procedures in preparing these GaN can be found elsewhere [20][21][22]. Then exfoliated GaN nanomembranes were transferred mechanically by lifting them with a 40 nm thick tungsten probe then place them on a sapphire substrate [20].…”
Section: Methodsmentioning
confidence: 99%
“…The GaN wafers were grown using hypride vapor phase epitaxy (HVPE) technique. The details of growth procedures in preparing these GaN can be found elsewhere [20][21][22]. Then exfoliated GaN nanomembranes were transferred mechanically by lifting them with a 40 nm thick tungsten probe then place them on a sapphire substrate [20].…”
Section: Methodsmentioning
confidence: 99%
“…In order to achieve such ideal GaN crystals, various growth techniques-such as the hydride vapor phase epitaxy (HVPE) method, the ammonothermal method, or a combination of both-have been studied by many researchers. [8][9][10][11][12][13] We also attempted HVPE homoepitaxial thick growth on a seed GaN wafer produced with a multi-point-seed (MPS) technique by the Na-flux method. 14) Large-diameter (>2″) GaN wafers with low TDD on the order of 10 3 -10 5 cm −2 could be obtained after the coalescence of crystals grown from individual small seeds.…”
mentioning
confidence: 99%
“…The performance of early GaN-based power devices, which were made on foreign substrates, were far behind expectations owing to their high threading dislocation densities (TDDs), in the 10 8 to 10 9 cm −2 range. 1,2) However, the use of native freestanding GaN substrates with low TDD values in the 10 6 cm −2 range or lower, which were developed by several groups, including ours, [3][4][5][6][7][8] made it possible to realize highperformance devices having high voltage-blocking capabilities together with low on-resistances, as expected from the wide band gap of the materials. [9][10][11][12][13] To achieve high breakdown voltages in GaN Schottky and PN diodes (PNDs), precise control of the donor concentration in the drift layers within the range of 10 16 cm −3 or lower is required.…”
mentioning
confidence: 99%