Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching

“…In this work, the composition was fixed at 1 wt% TiO 2 as due to the notable alteration obtained on the microstructure compared with pristine SAC solder. Based on our previous research [15], the additions of 1 wt% of TiO 2 eliminates large Cu 6 Sn 5 on the morphology and changes the shape of this IMC layer based on the cross-section view. Besides that, at 1 wt% of TiO 2 additions, the indention area and depth were reduced.…”

“…Observations of the reinforcement particles are possible with these conventional methods, but it is usually challenging. In our recent work, the dominant distribution of TiO 2 nanoparticles near the Cu 6 Sn 5 IMC layer had been determined through a series of nanoindentation arrays [15]. The selectively removing the β-Sn phase might provide better observation of the Cu 6 Sn 5 IMC phases and the TiO 2 nanoparticles, and it improves the elemental detection process as well [16,17].…”

Kesan Kemasan Permukaan Berbeza terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307 menggunakan Pendekatan Pelekukan Nano

“…Kedua jenis bahan ini digaul perlahan-lahan selama 30 s untuk percampuran yang homogen, dituang ke dalam bekas acuan dan dibiarkan mengeras pada suhu bilik selama empat jam. Seterusnya, proses lelasan dijalankan menggunakan kertas las SiC (Buehler) dari gred kasar kepada gred halus (400, 600, 800, 1200, 2000 grit) (Yahaya et al 2016). Proses penggilapan pula menggunakan semburan berlian bersaiz 1 μm bagi mendapatkan permukaan sampel yang bebas daripada kesan calar.…”

Introductory Chapter: Overview of Recent Progress in Soldering Materials

“…graphene and carbon-nanotube are among the popular materials to be used in composite solders. These inert particles (mostly of nanosize) are nonreacting with the molten solder during the reflow process, which helps to refine the IMC's structure and consequently improve the mechanical and other properties [7][8][9]. Composite solders have therefore attracted considerable attention.…”

“…Areas of the nanoindentation marks on the cross-sectioned surface of (a) SAC305 and (b) the hysteresis plot of the loading and unloading indenters for SAC305, adapted from Ref. [9].…”