“…After dephasing, highly energetic carriers try to reach thermal equilibrium by hole–hole scattering and hole–phonon scattering, and as a consequence, the lattice reaches a higher temperature. , Later on, heat is dissipated to the surrounding environment by phonon–phonon scattering. , After pump excitation, the sequential plasmonic events are presented graphically in Figure . However, in the presence of the hole-accepting state, the photoexcited charge carrier can be easily transferred to the adjacent molecules. , In metal NPs, energetic hot electrons are transferred to the lowest unoccupied molecular orbitals of the adsorbate and also can be transferred to the conduction band of the adjacent semiconductor depending on the energy band diagram. ,, Similarly, for semiconductor plasmonic material, upon excitation the hot hole can be transferred to the adjacent highest occupied molecular state of the molecules as well as of the valence band of the adjacent semiconductor materials. − Figure demonstrate the CID effect in the presence of different surface ligands such as oleylamine (OLM) and 3-mercaptopropionic acid (3-MPA). The existence of the CID was evidenced by the accelerated dephasing process of plasmon and peak broadening of the LSPR.…”