Heat-assisted μ-electrical discharge machining of silicon

Daud, Noor Dzulaikha; Ghazali, Farah Afiqa Mohd; Hamid, F. K. A.; Nafea, Marwan; Saleh, Tanveer; Leow, Pei Ling; Ali, Mohamed Sultan Mohamed

doi:10.1007/s00170-021-06734-y

Cited by 4 publications

(2 citation statements)

References 23 publications

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“…To enhance the EDM process of this ceramic, the infiltration of free Si into the SiC bulk material is presented as one of the most common techniques since it allows its electrical resistivity to be reduced down to 10 Ωcm, without affecting the mechanical properties of the material [15]. However, new techniques can be found in the literature such as those proposed by [16] and [17]. The first one suggests increasing the temperature of Si wafers to increase, in turn, their electrical conductivity.…”

Section: Introductionmentioning

confidence: 99%

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A study on the EDM drilling of reaction-bonded silicon carbide using different electrode materials

Torres-Salcedo¹,

Luis-Pérez²,

Puertas-Arbizu³

et al. 2023

Int J Adv Manuf Technol

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Today, there is a growing demand for efficient hole manufacturing technology in many industries such as aeronautics, automotive and nuclear, among others. Thus, the present study deals with the machining of through holes on SiSiC advanced ceramic by using Electrical Discharge Machining (EDM) drilling technology. Since recommendations related to the electrode characteristics and settings parameters are found to be scant for the industrial use of EDM drilling of SiSiC ceramics, this research work comes to cover this gap as it presents a complete study focused on the influence on different electrodes under rough and finish machining conditions. In particular, the influence of four electrodes materials (copper, copper-tungsten, graphite and copper infiltrated graphite) and three different electrode diameters ranging from 2 to 4 mm are investigated. In addition, the rotational speed of the electrode is also analysed. From the experimental results, both electrode material and machining regime, seem to be the most relevant factors of all. In the case of 2 mm diameter electrode, material removal rate (MRR) with Cu electrode was, approximately, 4.5 times higher than that obtained with a C electrode. In fact, it was found that copper electrode rotating at 20 rpm combined with high values of discharge energy (I = 2 A; ti = 70 µs) is the most economical option in terms of production cost and production time, as it gives a high MRR of 0.4754 mm3/min and a minimum electrode wear (EW) value of 7.52%. Moreover, slightly higher values of MRR were achieved for CuC electrode compared to those obtained with C electrode, indicating that the addition of Cu in the electrode contributes to a greater removal of material. However, a value of Ra of 0.37 µm could be obtained by setting low current intensity values (I = 0.5 A; ti = 45 µs) combined with C electrodes and with no rotation.

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Section: Introductionmentioning

confidence: 99%

“…Fig 16. Effect of rotational speed on Ra at different electrode materials and working conditions (electrode diameter 2 mm)…”

mentioning

confidence: 99%

A study on the EDM drilling of reaction-bonded silicon carbide using different electrode materials

Torres-Salcedo¹,

Luis-Pérez²,

Puertas-Arbizu³

et al. 2023

Int J Adv Manuf Technol

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Non-traditional machining techniques for silicon wafers

Daud

Hasan

Saleh

et al. 2022

Int J Adv Manuf Technol

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Silicon (Si) micromachining techniques have recently witnessed significant advancement, attributable to the high surge in demand for microelectromechanical and microelectronic devices. Micromachining techniques are widely used to cut or pattern Si, in order to obtain high-quality surface finishes for the fabrication of devices. Micromachining techniques are used for the fabrication of three-dimensional (3D) microstructures for microelectromechanical devices. In this work, the capabilities and competencies of non-traditional Si micromachining techniques, including ultrasonic, ion beam milling, laser machining, and electrical discharge machining, are discussed and compared accordingly. The working principles, advantages, limitations, and Si microstructures that have been fabricated before are discussed in detail. Additionally, this work covers the performance reported by multiple researchers on these micromachining methods, spanning the temporal range of 1990 to 2020. The key outcomes of this study are explored and summarized.

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