2020
DOI: 10.1007/s10853-020-05046-y
|View full text |Cite
|
Sign up to set email alerts
|

Heat-insulating materials with high-temperature resistance through binding hollow glass microspheres with vinyl-functionalized polyborosiloxane

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
11
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
10

Relationship

0
10

Authors

Journals

citations
Cited by 19 publications
(11 citation statements)
references
References 38 publications
0
11
0
Order By: Relevance
“…These thermal insulation materials generally have a porous or hollow structure. In comparison, inorganic hollow particles have the advantage of high mechanical strength and therefore can be used under strict conditions. However, due to the poor compatibility, inorganic hollow particles cannot be employed directly. They should be incorporated into polymers to form inorganic/polymer composites.…”
Section: Introductionmentioning
confidence: 99%
“…These thermal insulation materials generally have a porous or hollow structure. In comparison, inorganic hollow particles have the advantage of high mechanical strength and therefore can be used under strict conditions. However, due to the poor compatibility, inorganic hollow particles cannot be employed directly. They should be incorporated into polymers to form inorganic/polymer composites.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, boron- and silicon-containing polymers, namely, polyborosiloxanes (PBSs) have been extensively studied due to their heat resistant, flame retardant, ceramic forming, , and self-healing properties. The latter is due to the nature of the −B–O–Si– bond in the network structure, which splits and combines reversibly due to moisture susceptibility.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, the research on filled foaming materials has never stopped. Like zhang [1] et al prepared thermal insulation materials with a density of about 0.30 g/cm 3 , a thermal conductivity of 0.045 W/m• K, and a maximum compressive strength of 10.32 MPa using hollow glass microspheres as the functional phase of thermal insulation and vinyl polyborosiloxane as the matrix. But when preparing thermal insulation materials by filling polymer matrix with hollow structured microspheres, it is necessary to continuously increase the content of hollow structured microspheres in the matrix to achieve low thermal conductivity of the composite material, which will lead to increasing viscosity of the composite system and eventually loss of processability.…”
Section: Introductionmentioning
confidence: 99%