2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium 2011
DOI: 10.1109/stherm.2011.5767181
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Heat sink design optimization using the thermal bottleneck concept

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Cited by 13 publications
(5 citation statements)
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“…Note that, as discussed in Section 2.2, the steady-state temperature of the heat sink T s is directly connected to the maximum junction temperature T j via formulas (3) and (2). Therefore, all aforementioned optimization problems can be alternatively formulated such that a minimal value for T s is sought instead of…”
Section: Heat Sink Design Optimizationmentioning
confidence: 99%
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“…Note that, as discussed in Section 2.2, the steady-state temperature of the heat sink T s is directly connected to the maximum junction temperature T j via formulas (3) and (2). Therefore, all aforementioned optimization problems can be alternatively formulated such that a minimal value for T s is sought instead of…”
Section: Heat Sink Design Optimizationmentioning
confidence: 99%
“…A common approach in heat sink design is to combine simulation models with numerical optimization methods in order to optimize the heat sink's geometry with respect to a quantity of interest (QoI) related to the thermal behavior of the device [2][3][4][5][6]. This optimization is commonly conducted under cost-and sizerelated constraints.…”
Section: Introductionmentioning
confidence: 99%
“…Rather than using CFD modeling as a standalone heat sink design tool, this technique can complement analytical and semi-empirical thermal design tools, by providing a more accurate assessment of heat sink thermofluid performance [31] and offering useful heat transfer visualizations [32]. Numerical visualization can enable a designer to understand and interact with the physical heat transfer mechanisms, and assist in identifying solutions.…”
Section: Computational Fluid Dynamics Modelingmentioning
confidence: 99%
“…Thermal BottleNeck distribution was also used to directly modify fin thickness of a pre-optimized heatsink [4]. The Thermal BottleNeck values in each fin were noted and the fin thicknesses modified in an attempt to equalize the BN in each fin, leading to a marked improvement in thermal performance.…”
Section: Introductionmentioning
confidence: 99%
“…It was observed that the heatsink grew as a tree-like structure from the center of the heat source. This process was also applied to grow the heatsink where the Thermal BottleNeck was largest [3], producing slightly improved behaviour compared to using surface temperature to drive the additive design process.Thermal BottleNeck distribution was also used to directly modify fin thickness of a pre-optimized heatsink [4]. The Thermal BottleNeck values in each fin were noted and the fin thicknesses modified in an attempt to equalize the BN in each fin, leading to a marked improvement in thermal performance.…”
mentioning
confidence: 99%