Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

Fang, Chaojun; Wu, M. C.; Kuo, Yang-Kuao; Lee, C. Y.; Peng, Chih Wei; Hung, Y. H.

doi:10.1115/1.2804087

Cited by 4 publications

(2 citation statements)

References 9 publications

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“…It was demonstrated by Fang et al [50] that viscoelastic properties inside PCB should be considered when investigating its dynamic responses during board level drop test. Higher viscosity inside substrate materials will cause the PCB damping coefficient to increase.…”

Section: Materials Characterization For Finite Elementmentioning

confidence: 98%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

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Section: Materials Characterization For Finite Elementmentioning

confidence: 98%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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“…They found that conduction plays a very significant role at the initial part of the transient. Fang et al [32] reported experimental measurements of transient mixed convection heat transfer characteristics of jet impingement onto a horizontally rotating ceramicbased multichip disk. Their results were presented in term of transient dimensionless temperature distribution on the chip, transient heat flux distribution of input power, and local and average Nusselt numbers.…”

Section: Introductionmentioning

confidence: 99%

Transient Conjugate Heat Transfer During Free Liquid Jet Impingement on a Rotating Solid Disk

Rahman

Lallave

2009

Numerical Heat Transfer, Part A: Applications

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This article presents the transient conjugate heat transfer characterization of a free liquid jet impinging on a rotating solid disk of finite thickness and radius. Calculations were done for a range of Reynolds number (500-1400), Ekman number (6.62 Â 10 25 -1), disk thicknesses to nozzle diameter ratio (0.17-1.67), and solid to fluid thermal conductivity ratio (36.91-697.56) using water as the coolant. It was detected that the duration of the transient increased with disk thickness and decreased with Reynolds number and thermal conductivity ratio. A correlation for average Nusselt number for the transient heat transfer is presented.

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Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Lee

Fang

et al. 2007

Journal of Electronic Packaging

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An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design variables of stationary and rotating MCM disks with an unconfined round-jet impingement include the ratio of jet separation distance to nozzle diameter, Grashof number, jet Reynolds number, and rotational Reynolds number. The total experimental cases for stationary and rotating MCM disks are statistically designed by the central composite design method. In addition, a sensitivity analysis, the so-called analysis of variance, for the design factors has been performed. Among the influencing parameters, the jet Reynolds number dominates the thermal performance, while the Grashof number is found to have the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally, with the sequential quadratic programming technique, a series of thermal optimizations under multiconstraints—such as space, jet Reynolds number, rotational Reynolds number, nozzle exit velocity, disk rotational speed, and various power consumptions—has been systematically explored and discussed.

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Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

Cited by 4 publications

References 9 publications

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Transient Conjugate Heat Transfer During Free Liquid Jet Impingement on a Rotating Solid Disk

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

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