H igh pressure die casting (HPDC) is extensively used for mass production, due to the high productive efficiency of a desired component in a rapid solidification speed [1,2] . When HPDC molten alloy is injected into a relatively cold cavity of a die, the solidification rate is highly dependent on the interfacial heat transfer behavior in both the die and the molten alloy [3] , and subsequently influences the microstructure and the consequent mechanical properties of the final product [4][5][6][7] . In other words, a proper high cooling rate could favor the formation of fine microstructure in produced castings. Otherwise, too rapid a cooling rate could cause the premature solidification of the molten metal before the filling completion.Many studies have been carried out to investigate Abstract: Heat transfer at the metal-die interface has a great influence on the solidification process and casting structure. As thin-wall components are extensively produced by high pressure die casting process (HPDC), the B390 alloy finger-plate casting was cast against an H13 steel die on a cold-chamber HPDC machine. The interfacial heat transfer behavior at different positions of the die was carefully studied using an inverse approach based on the temperature measurements inside the die. Furthermore, the filling process and the solidification rate in different finger-plates were also given to explain the distribution of interfacial heat flux (q) and interfacial heat transfer . Due to this high velocity, the interfacial heat flux at the end of T 1 could firstly reach a highest value 7.92 MW•m -2 among the ends of T n (n=2,3,4,5). In addition, the q max and h max values of T 2 , T 4 and T 5 finger-plates increase with the increasing thickness of the finger plate. Finally, at the rapid decreasing stage of interfacial heat transfer coefficient (h), the decreasing rate of h has an exponential relationship with the increasing rate of solid fraction (f).Key words: high pressure die casting (HPDC); interfacial heat transfer behavior; metal/die interface; solidification speed; solid fraction CLC numbers: TG146.1