“…Among different ways to improve the heat transfer within PCM, the following so-called thermal conductivity enhancers can be distinguished: the addition of graphite fiber preforms, porous matrices, nanofillers (graphite, Cu, graphene), silica or alumina catalysts [1][2][3], PCM micro-or macro-encapsulation with organic or metal shells [4,5] or immersing highly thermally conductive complex metal structures within the PCM [6][7][8][9][10]. Such structures (e.g., metal foams (i.e., Al, Cu, FeCrAlY [11]), pipes, plate-fin and pin-fin structures (i.e., steel, Al, Cu) or honeycomb-shaped inserts) can be applied in a form of compact heat exchangers due to their high heat transfer surface area per unit volume and lead to the altered heat flow, enhancing the mixing and fluid dynamics and especially strengthening the thermal conduction and convection. Tao et al, investigating the performance of metal foams/paraffin composite PCM, found out that reducing the Materials 2020, 13, 415 2 of 11 foam cells' size enhances strongly the conduction heat transfer while simultaneously limiting the convection.…”