Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications

Bower, Cynthia E.; Ortega, Alfonso; Skandakumaran, P.; Vaidyanathan, Ranji; Phillips, Tristan

doi:10.1115/1.1852494

Cited by 27 publications

(9 citation statements)

References 11 publications

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“…Bower et al [22] presented experimental results on the heat transfer and flow in small SiC heat exchangers with multiple rows of parallel channels oriented in the flow direction. They analyzed the overall heat transfer and pressure drop coefficients in single-phase flow regimes and found that liquid-cooled SiC heat sinks easily outperform air-cooled heat sinks.…”

Section: Literature Reviewmentioning

confidence: 99%

Analytical Modeling of Fluid Flow and Heat Transfer in Microchannel/Nanochannel Heat Sinks

Khan

Yovanovich

2008

Journal of Thermophysics and Heat Transfer

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Laminar forced convection in two-dimensional rectangular microchannels and nanochannels under hydrodynamically and thermally fully developed conditions is investigated analytically in the slip-flow regime. Closed-form solutions for fluid friction and Nusselt numbers are obtained by solving the continuum momentum and energy equations with the first-order velocity slip and temperature jump boundary conditions at the channel walls. An isoflux thermal boundary condition is applied on the heat sink base. The results of the present analysis are presented in terms of the channel aspect ratio, hydraulic diameter, momentum and thermal accommodation coefficients, Knudsen number, slip velocity, Reynolds number, and Prandtl number. It is found that fluid friction decreases and heat transfer increases compared with no-slip flow conditions, depending on the aspect ratios and Knudsen numbers that include the effects of the channel size or rarefaction and the fluid/wall interaction.

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Section: Literature Reviewmentioning

confidence: 99%

Analytical Modeling of Fluid Flow and Heat Transfer in Microchannel/Nanochannel Heat Sinks

Khan

Yovanovich

2008

Journal of Thermophysics and Heat Transfer

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“…Bower et al [22] presented experimental results on the heat transfer and flow in small SiC heat exchangers with multiple rows of parallel channels oriented in the flow direction. They analyzed overall heat transfer and pressure drop coefficients in single phase flow regimes and found that liquid-cooled SiC heat sinks easily outperform air-cooled heat sinks.…”

Section: Literature Reviewmentioning

confidence: 99%

Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

Khan

Yovanovich

2007

ASME 2007 InterPACK Conference, Volume 1

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Laminar forced convection in two-dimensional rectangular micro and nano-channels under hydrodynamically and thermally fully developed conditions is investigated analytically in the slip flow regime (0.001 < Kn < 0.1). Closed form solutions for fluid friction and Nusselt numbers are obtained by solving the continuum momentum and energy equations with the first-order velocity slip and temperature jump boundary conditions at the channel walls. Isoflux thermal boundary condition is applied on the heat sink base. Results of the present analysis are presented in terms of channel aspect ratio, hydraulic diameter, momentum and thermal accommodation coefficients, Knudsen number, slip velocity, Reynolds number and Prandtl number. It is found that fluid friction decreases and heat transfer increases, compared to no-slip flow conditions, depending on aspect ratios and Knudsen numbers that include effects of the channel size or rarefaction and the fluid/wall interaction.

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“…Nakayama [9] clearly brings out the superiority of direct water cooling, especially in conjunction with microchannels. The use of external heat sinks with liquid cooled microchannels has also been extensively studied in the literature (e.g., Missaggia et al [10] and Bower et al [11]).…”

Section: Direct Cooling With Water-design Considerationsmentioning

confidence: 99%

Evaluation of Single Phase Flow in Microchannels for High Flux Chip Cooling: Thermohydraulic Performance Enhancement and Fabrication Technology

Kandlikar

Grande

2004

ASME 2nd International Conference on Microchannels and Minichannels

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The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooled technology. Direct liquid cooling of chips is being considered as a viable alternative. This paper reviews liquid cooling in terms of technological options and challenges. The possibilities presented herein indicate a four-to ten-fold increase in heat flux over the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify research opportunities in meeting the cooling demands of future IC chips. The use of three-dimensional microchannels that incorporate either microstructures in the channel of grooves in the channel surfaces may lead to enhancement in single-phase cooling. A simplified fabrication process is described that can build both classes of three-dimensional microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the fabrication process.

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Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications

Cited by 27 publications

References 11 publications

Analytical Modeling of Fluid Flow and Heat Transfer in Microchannel/Nanochannel Heat Sinks

Analytical Modeling of Fluid Flow and Heat Transfer in Microchannel/Nanochannel Heat Sinks

Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks

Evaluation of Single Phase Flow in Microchannels for High Flux Chip Cooling: Thermohydraulic Performance Enhancement and Fabrication Technology

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