Hermetic passivation of chip-on-board circuits

Gates, L. E.; Bakhit, G.; Ward, T.G.; Kubacki, Ronald M.

doi:10.1109/ectc.1991.163973

Cited by 8 publications

(1 citation statement)

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“…The thicknesses of the protective and insulating coatings are a trade-off between the pressure sensitivity and the reliability of the protective-coating layer. The thicker the coating the more it reduces the pressure sensitivity and increases the temperature dependency due to stiffening effects and temperature mismatch between the insulator and the encapsulated material [13]. If the coating is thin the risk of pinholes increases.…”

Section: Introductionmentioning

confidence: 99%

Media protected surface micromachined leverage beam pressure sensor

Melvås

Kälvesten

Stemme

2001

J. Micromech. Microeng.

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In this paper we present the first surface micromachined ultraminiaturized, highly sensitive, pressure sensor that utilizes a force-transducing beam and a 2 µm thick polysilicon pressure sensing diaphragm as an encapsulation layer for high media isolation of the sensing piezoresistor. A beam is attached to the diaphragm at one end and to the cavity at the other end. The pressure-induced diaphragm deflection is transduced to strain in the beam and sensed by a piezoresistive strain-gauge on the beam. The piezoresistor is thus well isolated from the sensing environment. The pressure sensing performance was measured to 0.9 µV V −1 mmHg −1 .

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Section: Introductionmentioning

confidence: 99%