Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials 2011
DOI: 10.7567/ssdm.2011.f-8-2
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Hetero-device complementary resistive switches with high switch speed and reliability for cross point array applications

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“…23) Recently, the crossbar architecture with different switching materials is the most promising candidate owing to its high density, high scalability potential, high nonvolatility, inherent 4F 2 cell size, three-dimensional (3D) integration for mass storage devices, and simplicity in fabrication. [24][25][26][27][28][29] Formation-free crossbar resistive switching memory devices fabricated using the Pt/Ti/Al 2 O 3 /Al structure with a resistance ratio of <10 at an I CC of 500 A have already been reported. 30) However, formationfree cross-point devices fabricated using a simple stack of iridium oxide (IrO x )/AlO x /W with superior memory performance at a very low current of 50 A have not been reported yet.…”
Section: Introductionmentioning
confidence: 99%
“…23) Recently, the crossbar architecture with different switching materials is the most promising candidate owing to its high density, high scalability potential, high nonvolatility, inherent 4F 2 cell size, three-dimensional (3D) integration for mass storage devices, and simplicity in fabrication. [24][25][26][27][28][29] Formation-free crossbar resistive switching memory devices fabricated using the Pt/Ti/Al 2 O 3 /Al structure with a resistance ratio of <10 at an I CC of 500 A have already been reported. 30) However, formationfree cross-point devices fabricated using a simple stack of iridium oxide (IrO x )/AlO x /W with superior memory performance at a very low current of 50 A have not been reported yet.…”
Section: Introductionmentioning
confidence: 99%