Heterogeneous Chip Integration Process for Flexible Wireless Microsystem Application

Chao, Tien Sheng; Liang, Chiawei; Cheng, Yu; Kuo, Chien-Nan

doi:10.1109/ted.2010.2102357

Cited by 9 publications

(6 citation statements)

References 14 publications

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“…91 SU-8 is a flexible polymer usually attached to PDMS substrate in flexible electronic systems as a photo-resist and it is comparatively easier to handle at wafer levels. 92 Kapton polyamide exhibits low dielectric loss, greater thermal stability 89 and an ultimate tensile strength of 231 MPa. 85 Conventionally, thin copper foils are used as flexible conducting material, 93 but they are not stretchable.…”

Section: Flexible and Stretchable Materialsmentioning

confidence: 99%

Applications of Microwave Materials: A Review

Raveendran

Sebastian

Raman

2019

Journal of Elec Materi

147

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The performance of microwave devices mainly depends on the properties of materials used in the fabrication. Knowledge of material properties at microwave frequencies is a prerequisite to select suitable materials for various microwave applications and vice versa. In this review, seven categories of materials and their applications in a microwave regime are elaborately discussed. The categories include magnetic materials, carbon-based materials, flexible or stretchable materials, biomaterials, phantoms, tunable materials and metamaterials. A brief overview of other important microwave materials such as low-loss ceramic dielectric materials, low-loss polymer ceramic composites, glass ceramics and multilayer ceramics is also given. The objective of this review is to expose the world of materials for wide microwave applications and thereby properly assisting the material selection for specific applications. Moreover, this review has dual significance. It helps material scientists to develop new materials and modify the properties of the available materials with respect to the application requirements. It also assists microwave engineers to select and use appropriate materials for different microwave applications.

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Section: Flexible and Stretchable Materialsmentioning

confidence: 99%

Applications of Microwave Materials: A Review

Raveendran

Sebastian

Raman

2019

Journal of Elec Materi

147

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“…Instead of SOI wafers, two silicon substrates bonded using the SU-8 can enable a more flexible design including low parasitic substrate capacitance and low manufacturing cost. Chao et al 15 presented a low-cost heterogeneous integration technology to assemble a CMOS chip with an organic substrate (SU-8/PDMS) using low temperature Au-Au thermocompressive bonds (o200 1C) for flexible wireless microsystem fabrication. À15 dB return loss and À0.25 dB insertion loss @ 40 GHz of a microstrip-tocoplanar waveguide interconnect transition between CMOS chip and SU-8 substrate was also successfully developed for the application.…”

Section: Microfabrication Processesmentioning

confidence: 99%

SU-8 for Microsystem Fabrication

Chiu

Cheng

2014

Photocured Materials

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SU-8 is a negative-tone photoresist that can be used to fabricate thick, high aspect ratio structures. The thickness of SU-8 structures ranges from several micrometers to several hundred micrometers or up to millimeters by direct spin coating or stacking of multiple layers of dry films. Being a negative resist, SU-8 can be used to fabricate complex three-dimensional structures such as sealed microchannels or tilted optical surfaces by multiple exposures. Another feature of SU-8 is that its properties can be controlled and modified during processes by the exposure doses, baking temperature, or even additives. This provides possibilities for novel device design and fabrication without complex fabrication processes. SU-8 has relatively low loss and absorption in the RF and visible spectral ranges, therefore, it has been used to fabricate various sensing, optical, and RF components and systems. This chapter summarizes the basic material properties and fundamental fabrication processes of SU-8. Examples of various structures, actuators, sensors, and fluidic/optical/RF components are presented to demonstrate the wide possibility of devices that can be implemented in SU-8.

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“…The cleanness of bonding surface has been verified as a key process parameter to lower the metal-metal bonding temperature. Therefore, a surface cleaning treatment using a mixture of H 2 SO 4 and H 2 O 2 for 180 seconds is adopted to effectively remove organic contamination from the Au pad surfaces for following bonding [11]. Once both surfaces of the CMOS chip and SU-8 substrate are cleaned, the CMOS chip is flip-chip bonded to the SU-8 substrate at the conditions of 180°C, which is lower than the glass transition temperature of fully cured SU-8, and 100MPa applied pressure for 3 minutes.…”

Section: B a Low Temperatre Au-au Thermocompressive Bondingmentioning

confidence: 99%

“…Via a wafer-level sacrificial release process for the SU-8 spiral ribbon fabrication and the previously developed low temperature bumpless Au-Au thermocompressive (TC) bonding process [10,11], a low cost and reliable heterogeneous integration of biomedical microsystems, such as a Si neural probing system interfaced with a system-on-package (SOP) circuits, can be truly realized.…”

Section: Introductionmentioning

confidence: 99%