“…To the best of our knowledge, the thermal decomposition of copper(I) polyvinylsiloxanes complexes sometimes occurs with the formation of size-controlled metal nanoparticles [7]. Furthermore, Cu(I)-olefin adducts are well known as sensitive coatings (elements, materials) of piezoelectric sensors [8]. It is noteworthy that there was a rash of reports about possibility of silica gel modification with unsaturated compounds [9][10][11] and further metal ions complexation [12].…”