2010
DOI: 10.4028/www.scientific.net/msf.645-648.771
|View full text |Cite
|
Sign up to set email alerts
|

Hexagonality and Stacking Sequence Dependence of Etching Properties in Cl<sub>2</sub>-O<sub>2</sub>-SiC System

Abstract: Thermal etching of hexagonal (4H-, 6H-, 8H- and 10H-), rhombohedral (15R- and 21R-), and cubic (3C-) SiC Si-faces was performed between 900 and 1000oC in a mixed gas of chlorine (Cl2) and oxygen (O2). In the case of well oriented Si-faces, the 3C-SiC (111) substrate was etched fastest in polytypes. The etching rate in the dislocation-free area depended on the hexagonality. Etch pits with definite shapes appeared, which depend on the type of dislocation and crystal structures. On the basis of these results, etc… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

2
5
0

Year Published

2012
2012
2019
2019

Publication Types

Select...
4

Relationship

2
2

Authors

Journals

citations
Cited by 4 publications
(7 citation statements)
references
References 5 publications
2
5
0
Order By: Relevance
“…The observed trend is comparable to the results reported elsewhere [19], which shows the etch-pit depth of 3C-SiC higher than that of other polytypes. In another study, the depth of etch pit decreased with increasing the hexagonality of SiC [19]. But, there is no obvious difference in etch rates of SiC pillars according to hexagonal polytypes and crystallographic orientations.…”
Section: Resultssupporting
confidence: 91%
See 3 more Smart Citations
“…The observed trend is comparable to the results reported elsewhere [19], which shows the etch-pit depth of 3C-SiC higher than that of other polytypes. In another study, the depth of etch pit decreased with increasing the hexagonality of SiC [19]. But, there is no obvious difference in etch rates of SiC pillars according to hexagonal polytypes and crystallographic orientations.…”
Section: Resultssupporting
confidence: 91%
“…It is thought that low crystalline quality of heteroepitaxially grown 3C-SiC layer, which is induced by the large lattice mismatch (almost 20%) between the 3C-SiC layer and the Si substrate, could be one of the possible reasons of higher etch rates than in the case of the single crystal substrates of α-SiC [18]. The observed trend is comparable to the results reported elsewhere [19], which shows the etch-pit depth of 3C-SiC higher than that of other polytypes. In another study, the depth of etch pit decreased with increasing the hexagonality of SiC [19].…”
Section: Resultssupporting
confidence: 85%
See 2 more Smart Citations
“…Beside the experimental work described here, micro-Raman spectroscopy and thermal oxidation were used to determine the polytype and the polarity of the substrates [6]. The substrates were polished to obtain an off angle of ~ 5º toward the [11-20] direction.…”
Section: Methodsmentioning
confidence: 99%