2007 IEEE International Symposium on Electromagnetic Compatibility 2007
DOI: 10.1109/isemc.2007.207
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High-Accuracy Emission Simulation Models for VLSI Chips including Package and Printed Circuit Board

Abstract: The electromagnetic emission of complex very large scale integrated circuits is determined by their operation activity plus the manifold noise propagation paths through the on-chip power routing, the package traces and the planes and traces on the printed circuit board. The design of any emission test board influences the emission finally measured at defined probing connectors. Good simulation models have to serve two main interests: (1) identification of emission-related IC design weaknesses and estimation of… Show more

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Cited by 14 publications
(10 citation statements)
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“…Now the transfer function of the order reduced system is transformed into the rational transfer function as in (7). The rational part of the transfer function contains 26 poles, which is equal to the size of the matrices in (9), used in the Lyapunov based MOR.…”
Section: Resultsmentioning
confidence: 99%
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“…Now the transfer function of the order reduced system is transformed into the rational transfer function as in (7). The rational part of the transfer function contains 26 poles, which is equal to the size of the matrices in (9), used in the Lyapunov based MOR.…”
Section: Resultsmentioning
confidence: 99%
“…An IC conducted emission model created as described in [9], consists of thousands of electrical elements. In the following example the model is described by Z-parameters, since currents are chosen as inputs for all ports.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Analogue and digital part in mixed-signal circuits are mainly coupled through the substrate, the package and interconnects. These parasitic couplings can be modelled by large passive networks composed of resistors, capacitors and inductors as shown in Figure 1 (Verghese et al, 2004;Stanisic et al, 1994;Chen and Neely, 1998;Steinecke et al, 2007). The digital switching currents act as distributed sources inside the IC and can be modelled with a large number of independent current sources ( Figure 1; Verghese et al, 2004;Steinecke et al, 2007;Gstottner et al, 2007).…”
Section: Introductionmentioning
confidence: 99%
“…Electrical macromodels of the electromagnetic compatibility (EMC) behavior of chips are created to help semiconductor manufacturers to take EMC effects into account during the design process. The macromodels can contain thousands of passive electrical elements and independent sources as well as a high number of pins [4], [5]. The high complexity leads to long simulation times.…”
Section: Introductionmentioning
confidence: 99%