“…The trend of ever decreasing feature sizes in subsequent lithography generations runs parallel to the need for higher performance resists, in terms of resolution, contrast and etch resistance during pattern transfer [2][3][4][5]. In particular, a range of applications, including X-ray Fresnel lenses [6,7], NEMS [8][9][10], photonic metamaterials [11][12][13], polarizers [14][15][16], and biomolecules sorting devices [17,18] require the ability of fabricating high-resolution high-aspect-ratio structures. However, this usually entails a trade-off between the best performing conditions for attaining the highest resolution by electron beam lithography (EBL), i.e.…”