“…The deposition rate in the case of HWCVD is also found to be higher especially for nano and microcrystalline silicon films, where PECVD requires heavy hydrogen dilution causing the deposition rates to drop down significantly. Interestingly, in HWCVD, the microstructure of the films can be easily changed from amorphous to microcrystalline by just varying any of the process parameter i.e., substrate or filament temperature, process pressure [2,3]. In this paper, we present our results on the influence of pure silane gas flow rate on the microstructure and electrical conductivity of silicon films prepared using HWCVD.…”