High conductivity copper-boron alloys obtained by low temperature annealing

Zhang, S.-L; Harper, J. M. E.; d’Heurle, F. M.

doi:10.1007/s11664-001-0215-8

Cited by 11 publications

(4 citation statements)

References 6 publications

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“…During rolling, wear debris and oxides form a thick contaminant layer in the zone of contact with the mating surfaces. 22,23 The three-dimensional morphology of normal and oxidized RCF of thickness 40 lm are shown in Fig. 7.…”

Section: Electrical Conductivity Of Rcfmentioning

confidence: 99%

Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil

Xiong

Sun

et al. 2015

Journal of Elec Materi

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X-ray diffraction and transmission electron microscopy have been used to study the microstructure of copper foil during rolling. Annealing was used to release work hardening of rolled copper foil (RCF), and electrical conductivity was determined by use of a PPMS-9 comprehensive physical property-measurement system. The microstructure and electrical conductivity of RCF are discussed. Our results showed that the relative intensity of the (220) diffraction peak increased continuously with decreasing sample thickness and that rolling induced preferred orientation. Many obvious crystallographic defects were present; these seriously affected electrical conductivity. The electrical conductivity of RCF decreases with increasing lattice distortion and micro defects which occur during deformation, especially when the surface adsorbs lubricant. However, annealing reduced lattice distortion and the scattering of conducting electrons at these defects, thus improving the electrical properties. For foil thickness in the range 25-180 lm, annealing temperatures in the range 150-300°C, and annealing times in the range 2.5-3.0 h, the electrical conductivity of RCF increased with increasing thickness and annealing temperature, and decreased with increasing annealing time.

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Section: Electrical Conductivity Of Rcfmentioning

confidence: 99%

Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil

Xiong

Sun

et al. 2015

Journal of Elec Materi

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“…Also, a relatively abrupt shift of the Cu (111) spectrum, to 2θ lower, was seen above 300°C, possibly due to the relaxation in the compressive stress of the supersaturated solid solution as the boron precipitates along the grain boundaries. 18,19 Figure 2 shows the AES depth profiles of the asdeposited Cu/Ti/SiO 2 and of those annealed at 300-600°C. Annealing at 400°C allowed for interdiffusion between the Cu and Ti, and for outdiffusion of Ti to the Cu surface.…”

Section: Resultsmentioning

confidence: 99%

“…[13][14][15] In addition, the consumption of Ti in the formation of titanium boride can limit its supply for the Ti-SiO 2 reaction, effectively suppressing SiO 2 decomposition. 18 Further, the boron added to Cu can passivate the copper surface, possibly due to the formation of surface boron oxide. Therefore, the Cu(B) alloy/Ti/SiO 2 structures have been annealed to investigate the behavior of boron, and its resultant effects on Cu-Ti inter-diffusion, resistivity, texture, and diffusion barrier properties.…”

Section: Introductionmentioning

confidence: 99%

The effects of boron in the Cu(B)/Ti/SiO2 system on the Cu-Ti reaction, resistivity, and diffusion barrier properties

Yang

Lee

Park

et al. 2005

Journal of Elec Materi

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The behavior of boron in Cu(4.8at.%B)/Ti/SiO 2 was investigated as a function of temperature, and its influences on the Cu-Ti interaction, resistivity, and diffusion barrier properties were also studied. The results showed the formation of a titanium boride layer at the Cu-Ti interface, after heating the Cu(B)/Ti/SiO 2 at 400°C and higher, effectively served as a barrier for the Cu and Ti diffusion, and significantly enhanced the Cu (111) texture. The resistivity dropped from 16.3 to 2.33 µΩ-cm after heating at 600°C, and continued to decrease up to 800°C. As a result, the Cu, in the form of B(O) x /Cu/TiB 2 /Ti(O) x /SiO 2 multilayers, obtained by heating the Cu(B)/Ti/SiO 2 , showed high thermal stability with low resistivity and, thus, can be used as interconnections in advanced integrated circuits. Since the Cu, in the form of B(O) x /Cu/TiB 2 /Ti(O) x /SiO 2 multilayers, obtained by heating the Cu(B)/Ti/SiO 2 , showed high thermal stability with low resistivity, it can be used as interconnections in advanced integrated circuits.

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“…However, the strength of pure copper is low and the strength gained during cold working will decrease quickly after annealing. So development high strength and high conductivity copper alloys with not only have a high plasticity but also a high conductivity simultaneously is necessary [4][5][6][7] . Presently, the main research concentrates on Cu-Cr, Cu-Fe and Cu-Ag alloys, a few of study on new copper alloys [8][9][10] .…”

Section: Introductionmentioning

confidence: 99%

Effects of annealing temperature on the electrical conductivity and mechanical property of Cu-Te alloys

Zhu

Huang²,

Song

et al. 2007

J. Wuhan Univ. Technol.

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The effects of annealing temperatre on the electrical conducitivity and mechanical property of Cu-Te alloys were studied via an AG-10TA electronic universal machine, an SB2230 digital electric bridge, SEM, EDS and XPS. The results show the electrical conductivity increases while the tensile strength fluctuates when the annealing temperature becomes higher because the recrystallization occurs during the annealing process, leading to the density of dislocation decreasing, grain size growing up, but the second phase precipitating suffi ciently and simultaneously.

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High conductivity copper-boron alloys obtained by low temperature annealing

Cited by 11 publications

References 6 publications

Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil

Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil

The effects of boron in the Cu(B)/Ti/SiO2 system on the Cu-Ti reaction, resistivity, and diffusion barrier properties

Effects of annealing temperature on the electrical conductivity and mechanical property of Cu-Te alloys

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