International Technical Digest on Electron Devices
DOI: 10.1109/iedm.1990.237226
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High density dual-active-device-layer (DUAL)-CMOS structure with vertical tungsten plug-in wirings

Abstract: A DJal-Active-Device-byer(DUAL)-CMOS structure has been developed for achieving high density LSIs. It consists of NMOSFETs in a lower bulk-Si and PMOSFETs in an upper SO1 film. The most important structural feature is that upper PMOSFET electrodes are directly interconnected to lower NMOSFET electrodes using a vertical tungsten plug-in wiring technique. The plug-in wirings perform that the device area is reduced to approximately 50%, as compared with that of a conventional bulk-Si CMOS. The contact resistance … Show more

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