High density optical interconnects using VCSEL and polymer waveguides for board and backplane applications

Liu, Y.S.; Wojnarowski, R.J.; Hennessy, W.; Rowlette, John R.; Stack, Jared D.; Kadar‐Kallen, Michael A.; Liu, Yue; Bristow, Julian P. G.; Peczalski, A.; Eldada, Louay A.; Yardley, James T.; Osgood, R. M.; Scarmozzino, R.; Lee, S.H.; Patra, S.

doi:10.1109/leos.1997.630615

Cited by 7 publications

(2 citation statements)

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“…Thus, there is a need for an alternative strategy for realizing a high-speed system. 2,3,4 In recent years, many studies have reported developments on board and backplane solutions, 5,6,7 plasticoptical-fiber-based inter-chip interconnection concepts 8,9,10 in order to reduce the microelectronics interconnection problem. Furthermore, solutions for optical free-space interconnects for inter-chip and backplane applications 11,12,13 have been demonstrated.…”

Section: Introductionmentioning

confidence: 99%

Optical link by using optical wiring method for reducing EMI

et al. 2008

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A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and susceptibility.This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-electronics), the purely optical part and optical link(interconnection) is free of these problems. 1 An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems.

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Section: Introductionmentioning

confidence: 99%

Optical link by using optical wiring method for reducing EMI

et al. 2008

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“…In recent years a lot of R&D effort has been spent in developing optical chip-to-chip interconnects in order to reduce the microelectronics interconnection problem [17]. Apart from board and backplane solutions [4], [12], [15], [18] also POFbased interchip interconnection concepts are under development [3], [25]. Furthermore, solutions for optical free-space interconnects for interchip [19] and backplane application [1], [5] have been demonstrated.…”

Section: Introductionmentioning

confidence: 99%

A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems

Griese

2001

IEEE Trans. Adv. Packag.

113

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A new and innovative interconnection technology applicable for printed circuit boards is presented. This technology is widely compatible with the existing design and manufacturing processes and technologies for conventional multilayer pc boards and it combines electrical and optical interconnects on pc board level. It provides the potential for on-board bandwidth of several Gb/s and closes the bottleneck caused by the limited performance of electrical interconnection technology. After giving an overview on the most important basic technologies and first available results and engineering samples, the focus of this paper is on the development of appropriate modeling methodologies and simulation algorithms necessary for designing and optimizing optical on-board interconnects within the conventional electrical pc board environment.Index Terms-Board-integrated multimode waveguides, design and modeling of optical multimode interconnects, electrical-optical printed circuit boards, modeling of laser-diodes and photodiodes, optical interconnection technology.

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Lighting the way in computer design

Liu¹

1998

IEEE Circuits Devices Mag.

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High density optical interconnects using VCSEL and polymer waveguides for board and backplane applications

Cited by 7 publications

References 0 publications

Optical link by using optical wiring method for reducing EMI

Optical link by using optical wiring method for reducing EMI

A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems

Lighting the way in computer design

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