High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process

Abstract

Divinylsiloxane-bis-benzocyclobutene (DVS-BCB) has attracted significant attention as an intermediate bonding material, owing to its excellent properties. However, its applications are limited, due to damage to peripheral devices at high curing temperatures and unoptimized compressive pressure. Therefore, it is necessary to explore the compressive pressure condition for DVS-BCB bonding. This study demonstrates an optimization process for void-free DVS-BCB bonding. The process for obtaining void-free DVS-BCB bonding is a vacuum condition of 0.03 Torr, compressive pressure of 0.6 N/mm2, and curing temperature of 250 °C for 1 h. Herein, we define two factors affecting the DVS-BCB bonding quality through the DVS-BCB bonding mechanism. For strong DVS-BCB bonding, void-free and high-density chemical bonds are required. Therefore, we observed the DVS-BCB bonding under various compressive pressure conditions at a relatively low temperature (250 °C). The presence of voids and high-density crosslinking density was examined through near-infrared confocal laser microscopy and Fourier-transform infrared microscopy. We also evaluated the adhesion of the DVS-BCB bonding, using a universal testing machine. The results suggest that the good adhesion with no voids and high crosslinking density was obtained at the compressive pressure condition of 0.6 N/mm2. We believe that the proposed process will be of great significance for applications in semiconductor and device packaging technologies.

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

“…The silicone resins with more BCB groups have better performance compared with those with phenyl groups. BCB has good application prospects in many fields, such as bonding materials [26], liquid crystals [27], sensors [28,29], and microelectronics [30,31]. Compared with other functional silicones, BCB functionalized silicone resin has a lower dipole moment, which can effectively reduce the dielectric constant, and the benzene ring structure involved in the construction of the cross-linked network will bring additional strength.…”

Aerosol Jet Printing of a Benzocyclobutene‐Based Ink as Adhesive Material for Wafer Bonding Application

“…[42] However, no works have been reported on the AJP of benzocyclobutene (BCB), which is a thermoset polymer widely used in the electronic industry for applications such as wafer bonding, interlayer dielectric, and 3D integration. [47][48][49] Furthermore, the works reported in the literature do not cover some applications of dielectric polymers, such as wafer bonding.…”

Assessment of the Ageing and Durability of Polymers

“…The analysis of the effect of the application conditions on the performance of an adhesive was the subject of the study reported in [ 13 ]. The quality of the bond developed by a divinylsiloxane-bis-benzocyclobutene (DVS-BCB) adhesive was, in fact, related to the presence of voids, caused by an inadequate compression pressure and to an unsatisfactory cross-linking density depending on the processing temperature.…”