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Polymeric materials with a low dielectric constant are widely used in the electronic industry due to their properties. In particular, polymer adhesives can be used in many applications such as wafer bonding and three-dimensional integration. Benzocyclobutene (BCB) is a very interesting material thanks to its excellent bonding behavior and dielectric properties. Usually, BCB is applied by spin-coating, although this technology does not allow the fabrication of complex patterns. To obtain complex patterns, it is necessary to use a printing technology, such as inkjet printing. However, inkjet printing of BCB-based inks has not yet been investigated. Here, we show the feasibility of printing complex patterns with a BCBbased ink, reaching a resolution of 130 μm. We demonstrate that with a proper dilution, BCB-based inks enter the printability window and drop ejection is achieved without the formation of satellite drops. In addition, we present the conditions in which there is an appearance of the coffee ring effect. Inks that feature a too high interaction with the substrate are more likely to show the coffee ring effect, deteriorating the printing quality. We also observe that it is possible to achieve a better film uniformity by increasing the number of printed layers, due to redissolution of the BCB-based polymer that helps to level possible inhomogeneities. Our work represents the starting point for an in-depth study of BCB-based polymer fabrication using jet printing technologies, as a comparison of the bonding quality obtained with different materials and different technologies could give more information and broaden the perspective regarding this field.

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Aerosol jet printing (AJP) is an emerging additive manufacturing technology that is gaining increasing attention in the electronic field. Several studies have been carried out on the AJP of conductive, semiconductive, and dielectric polymers for electronic applications. However, wafer bonding is an application that is still uncovered by literature. Therefore, in this work, the AJP of benzocyclobutene (BCB) as a polymeric adhesive for wafer bonding is presented for the first time. A thorough characterization of the processing parameters is carried out to identify the most ideal conditions for printing at a relatively high speed. Then, square patterns are printed, proving the versatility of the AJP technology in terms of the reachable thickness of the deposited BCB patterns. Complex patterns with a resolution of ≈60 µm are also printed. The bonding properties of the BCB are characterized from a morphological and mechanical point of view. In particular, the shear strength of the BCB coatings deposited with AJP is ≈39 MPa and it is comparable with the shear strength of BCB coating deposited by spin‐coating. Consequently, AJP represents a valid alternative for the deposition of polymeric adhesive for wafer bonding.