2006
DOI: 10.1109/ted.2006.881052
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High-Density Reduced-Stack Logic Circuit Techniques Using Independent-Gate Controlled Double-Gate Devices

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Cited by 80 publications
(44 citation statements)
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“…This is of course the logic AND functionality from a single transistor, which can be employed in CMOS NAND gates as shown in Fig.15b. It provides impressive gains in Si area usage (∼50% reduction), switching speed (11% improvement for a four-input NAND) and power dissipation (10% reduction), which are experimentally confirmed (Chiang et al, 2006). While these result are impressive in themselves, the elegancy of the concept and flexibility it can provide in reconfigurable and programmable circuits are probably so far under-appreciated.…”
Section: Reconfigurable Static Dg Cmos Logicmentioning
confidence: 71%
See 1 more Smart Citation
“…This is of course the logic AND functionality from a single transistor, which can be employed in CMOS NAND gates as shown in Fig.15b. It provides impressive gains in Si area usage (∼50% reduction), switching speed (11% improvement for a four-input NAND) and power dissipation (10% reduction), which are experimentally confirmed (Chiang et al, 2006). While these result are impressive in themselves, the elegancy of the concept and flexibility it can provide in reconfigurable and programmable circuits are probably so far under-appreciated.…”
Section: Reconfigurable Static Dg Cmos Logicmentioning
confidence: 71%
“…Also, the clock inputs are designed using SDDG transistors in an effort to boost pre-charge and evaluation performance. Note that each pair of inputs driving the independent gates of a single nMOSFET actually carries out an AND functionality as implied by the high-V t (Chiang et al, 2006). It is therefore important to choose and control DG-MOSFET threshold accurately for this scheme to work.…”
Section: Compact Dynamic Digital Circuitsmentioning
confidence: 99%
“…This difference is explained by the fact that in the IG mode of low-V th FinFETs, the inversion layer can be easily formed. This channel shields further gate-to-gate coupling, and hence a huge drop in threshold voltage is not seen in this mode [17]. In contrast to low-V th devices, no inversion layer can be formed in the IG mode of high-V th FinFETs.…”
Section: Characteristics Of Low and High-v Th Devicesmentioning
confidence: 99%
“…In other words, these high-V th devices must be activated iff both their gates are activated in order to be suitable for merging series transistors. Note that high-V th FinFETs cannot be realized by engineering the channel dopant concentration, like [17], because the FinFET channel should be kept undoped to avoid excessive random dopant fluctuations. In this paper, we show that high-V th IG FinFETs can be realized by careful selection of FinFET physical parameters without the use of any additional bias voltages.…”
Section: Introductionmentioning
confidence: 99%
“…Such IG FinFETs are suitable for merging series transistors. Note that high-V th FinFETs cannot be realized by engineering the channel dopant concentration, like [12], because, the FinFET channel should be kept undoped to avoid excessive random dopant fluctuations.…”
Section: Dual-v Th Independent-gate Finfetsmentioning
confidence: 99%