“…There are also other methods such as grinding with sandpaper [48], crystal growth via oriented attachment mechanism [49], cyclic loading of a stainless steel indenter [50], joining of misaligned single crystal surfaces to form a bicrystal interface [3], and growth of thin films with moderate lattice mismatch to the underlying substrate [3].The density of dislocations introduced in ceramics ranges from about 10 12 to 10 16 m −2 while the initial value is about 10 9 to 10 10 m −2 [42,45,46,[50][51][52]. For metals, metalloids, and biomaterials, dislocation density as high as 10 17 m −2 or more has been experimentally reported [53][54][55][56]. In metals and metalloids, shock compression [54,55], electric-current stressing [53], and ultrasonic irradiation [57][58][59] have been used to induce the high dislocation density.…”