Abstract-In this paper, Al 2 O 3 film deposited by thermal atomic layer deposition (ALD) with diluted NH 4 OH instead of H 2 O was suggested for passivation layer and anti-reflection (AR) coating of the p-type crystalline Si (c-Si) solar cell application. It was confirmed that the deposition rate and refractive index of Al 2 O 3 film was proportional to the NH 4 OH concentration. Al 2 O 3 film deposited with 5 % NH 4 OH has the greatest negative fixed oxide charge density (Q f ), which can be explained by aluminum vacancies (V Al ) or oxygen interstitials (O i ) under O-rich condition. Al 2 O 3 film deposited with NH 4 OH 5 % condition also shows lower interface trap density (D it ) distribution than those of other conditions. At NH 4 OH 5 % condition, moreover, Al 2 O 3 film shows the highest excess carrier lifetime (τ PCD ) and the lowest surface recombination velocity (S eff ), which are linked with its passivation properties. The proposed Al 2 O 3 film deposited with diluted NH 4 OH is very promising for passivation layer and AR coating of the p-type c-Si solar cell.