2017
DOI: 10.1109/tcsii.2016.2563698
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High-Efficiency E-Band Power Amplifiers and Transmitter Using Gate Capacitance Linearization in a 65-nm CMOS Process

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Cited by 32 publications
(8 citation statements)
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“…Theoretically, the maximum efficiency of Class A, AB, B and C PAs are 50%, 50%-78% (0-6 dB gain drop), 78.5% (6 dB gain drop) and 78.5% (greater than 6 dB gain drop), respectively. Studies [13][14][15][16][17] have shown some common techniques to improve the efficiency of CMOS PAs. Either, for a 20 MHz narrowband at2.4 GHz, or 10 MHz narrowband at sub-1 GHz, it is still a challenge for circuit designers to boost PAE of PA, especially when avoiding balun networks and high inductances models.…”
Section: Commonly Used Techniques In Traditional Pa Architecturesmentioning
confidence: 99%
“…Theoretically, the maximum efficiency of Class A, AB, B and C PAs are 50%, 50%-78% (0-6 dB gain drop), 78.5% (6 dB gain drop) and 78.5% (greater than 6 dB gain drop), respectively. Studies [13][14][15][16][17] have shown some common techniques to improve the efficiency of CMOS PAs. Either, for a 20 MHz narrowband at2.4 GHz, or 10 MHz narrowband at sub-1 GHz, it is still a challenge for circuit designers to boost PAE of PA, especially when avoiding balun networks and high inductances models.…”
Section: Commonly Used Techniques In Traditional Pa Architecturesmentioning
confidence: 99%
“…An important criterion that designers should consider when using a transformer is the amount of power delivered from the source to the load, especially in applications such as WPT [3], [25], and impedance transformation in power amplifiers [1], [2], [4], [21], [22], [29]. We can assess the efficiency of the network with regard to the power from the transducer power gain G T , which is defined as the ratio of the power delivered to load P L to the power available from source P avs [16]:…”
Section: B Impedance Matching With Two Magnetically Coupled Coilsmentioning
confidence: 99%
“…In this section, we discuss the examination of a typical onchip winding transformer (presented in Fig. 3) that is widely used for interstage matching in millimeter-wave circuits in silicon technologies [1], [2], [29]- [31]. In this study, an onchip transformer was designed in a 0.18 µm CMOS process by using an 8.625 µm thick back-end-of-line (BEOL) stack and a 300 µm thick silicon substrate.…”
Section: Verification Of the Proposed Analysis With An On-chip Tmentioning
confidence: 99%
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“…It is challenging to implement high output power ( P out ) and high power‐added efficiency (PAE) V‐band (50–75 GHz) or W‐band (75–110 GHz) power amplifiers (PAs) using CMOS process mainly due to its low supply and breakdown voltages . To increase P out , a feasible way is to combine the power of several parallel PA units using power or current combiners.…”
Section: Introductionmentioning
confidence: 99%