2015
DOI: 10.3788/fgxb20153606.0692
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High Efficiency GaN-based High-voltage Light-emitting Diode Chips and Its Chip-on-board Packaging

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“…At present, the electro-optic efficiency of LED chips is only about 30%, and about 70% of the energy is converted into heat [2] . LED chips are high heat flux components, and the working temperature should be strictly controlled lower than 110℃ [3] . With the high integration density of the circuit and chips, the heat dissipation is great challenge for high-power LED light.…”
Section: Introductionmentioning
confidence: 99%
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“…At present, the electro-optic efficiency of LED chips is only about 30%, and about 70% of the energy is converted into heat [2] . LED chips are high heat flux components, and the working temperature should be strictly controlled lower than 110℃ [3] . With the high integration density of the circuit and chips, the heat dissipation is great challenge for high-power LED light.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, some scholars have proposed a variety of solutions to improve the heat dissipation. In terms of heat generation, Huang xiaosheng [3] optimized the width between the chip units, and the electro-optical efficiency increased to 36.83% under certain conditions; However, the electro-optic efficiency is still low, and the contribution is limited to heat dissipation; In the heat transfer, some new substrate materials have been developed [4][5][6] . But, as the light has a variety of materials, it's can't achieve the ideal effect by improving one of them.…”
Section: Introductionmentioning
confidence: 99%