2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) 2013
DOI: 10.1109/rfic.2013.6569602
|View full text |Cite
|
Sign up to set email alerts
|

High efficiency GaN switching converter IC with bootstrap driver for envelope tracking applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
13
1

Year Published

2014
2014
2020
2020

Publication Types

Select...
7
3

Relationship

1
9

Authors

Journals

citations
Cited by 39 publications
(14 citation statements)
references
References 6 publications
0
13
1
Order By: Relevance
“…For example, an envelope tracking bandwidth of 20 MHz with power device switching frequencies up to 200 MHz has been demonstrated due to the ongoing work on the integration of GaN high-electron-mobility-transistor (HEMT)-based gate drivers, and buck converters on insulating SiC substrates [1]. The potential use of this circuit for 5G applications using GaN on LR Si substrates, where both power and RF GaN devices featured on the same chip, will introduce the additional advantage of low cost and large diameter wafers, compared with high-resistivity Si and SiC technologies.…”
Section: Introductionmentioning
confidence: 99%
“…For example, an envelope tracking bandwidth of 20 MHz with power device switching frequencies up to 200 MHz has been demonstrated due to the ongoing work on the integration of GaN high-electron-mobility-transistor (HEMT)-based gate drivers, and buck converters on insulating SiC substrates [1]. The potential use of this circuit for 5G applications using GaN on LR Si substrates, where both power and RF GaN devices featured on the same chip, will introduce the additional advantage of low cost and large diameter wafers, compared with high-resistivity Si and SiC technologies.…”
Section: Introductionmentioning
confidence: 99%
“…Recent work on the integration of GaN HEMT based gate driver and buck converters on insulating SiC substrates has achieved envelope tracking bandwidths of 20 MHz [1] with power device switching frequencies up to 200 MHz. The potential use of this circuit for 5G applications using GaN on Si substrates were both Power and RF GaN on the same chip will offer the additional benefit of lower cost.…”
Section: Introductionmentioning
confidence: 99%
“…As a result of this difficulty, the power-added efficiency (PAE) of GaN VMCDs has typically not been high. In our work, the driver stage for the output pull-up FET is carried out with a bootstrap configuration, which increases its efficiency [5].…”
Section: Introductionmentioning
confidence: 99%