A method for photoelectrochemical (PEC) etching of Ga‐face, p ‐type GaN is presented using GaN/InGaN heterostructures. This technique, which does not require any special epitaxial structure, flip chip bonding, or complicated processing, is used to roughen p ‐side‐up lightemitting diodes (LEDs) to increase extraction efficiency. The extraction efficiency is increased by 20 ± 5% for roughened LEDs compared to nearby unetched LEDs, without any effect on the electrical properties of the devices. This is the first report of rapid, external‐bias free PEC etching of p ‐type GaN, which could have broad applications to low‐damage selective etching for a variety of electronic and optical devices. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)