“…Considering the multicarrier signal nature and the large envelope peak‐to‐average power ratio (PAPR), the SSPA efficiency must be optimized at the desired operating point and with the large envelope PAPR. Nonstandard SSPA architectures, such Doherty HPAs, could provide an attractive way of improving efficiency. - Microwave photonics offers high potential, especially for broadband applications thanks to
- extremely large bandwidth,
- –nearly lossless propagation in optical fiber within a spacecraft,
- –immunity to electromagnetic interference (EMI), and
- –lightweight, low volume, mechanically flexibility, galvanic isolation, and potential of integration into platform structures.
For these reasons, microwave photonics components have been proposed to be implemented at various levels on‐board, linking equipment to equipment, board to board, or even chip to chip in photonic PCBs. - On‐board digital processors will enable the flexibility in terms of beam‐forming, channelization, and routing with improvement needed on
- high‐speed and low‐power A/D and D/A converters,
- –high‐speed serial links (intraboards and interboards/equipment),
- –radiation‐tolerant ultra deep‐submicron application‐specific integrated circuit (ASIC) technology (high integration, low voltage, and low power),
- –high density packaging,
- –thermal management,
- –processor architecture/algorithm optimization, and
- –FPGAs/DSPs for reconfigurability.
…”