2017
DOI: 10.1016/j.mee.2017.05.041
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High-K metal gate stacks with ultra-thin interfacial layers formed by low temperature microwave-based plasma oxidation

Abstract: Ultra-thin interfacial silicon oxide layers are grown by microwave-based plasma oxidation at temperatures below 200 °C. The influence of plasma gas composition and plasma pulsing on layer properties is tested. The oxides are compared to standard thermally grown oxide and wet chemical oxide. Layer properties are evaluated by x-ray photo electron spectroscopy and are electrically characterized by means of TiN/HfO2/SiO2 high-k metal gate stacks

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Cited by 12 publications
(3 citation statements)
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“…In the case of Mg, Al and Si, the absence of M-M signals (M=Mg, Al, Si) in the XPS spectra of the reduced samples (Table 2, Figures S1-S3) was verified. In the case of Si and Mg, only signals attributed to Mg-O, at 50.0 eV, and Si-O, around 103.5-103.7, were observed [45,46]. Instead, signals that can be assigned to both Al-O and Al-OH were observed in Cu/Al 2 O 3 -I and CuMgAl samples [45].…”
Section: Physicochemical Characterizationmentioning
confidence: 97%
“…In the case of Mg, Al and Si, the absence of M-M signals (M=Mg, Al, Si) in the XPS spectra of the reduced samples (Table 2, Figures S1-S3) was verified. In the case of Si and Mg, only signals attributed to Mg-O, at 50.0 eV, and Si-O, around 103.5-103.7, were observed [45,46]. Instead, signals that can be assigned to both Al-O and Al-OH were observed in Cu/Al 2 O 3 -I and CuMgAl samples [45].…”
Section: Physicochemical Characterizationmentioning
confidence: 97%
“…This can be avoided using the microwave-based plasma oxidation technique operating at temperatures <400 • C [61,62]. Plasma oxidation provides oxides of up to ∼8 nm in thickness and high electrical quality [63,64] at reasonable oxidation times of some minutes. In collaboration with the company HQ Dielectrics GmbH (HQ-D), experiments were carried out with the HQ-D Hyperion LT tool [65] (suitable for processing up to ⊘ 300 mm wafers) to qualify the plasma process for the oxidation of NPs.…”
Section: Np Shrinkage Technologymentioning
confidence: 99%
“…The 28 nm high-K metal gate technology consists of TiN (8 nm), HfO2 (10 nm), and SiON (1.2 nm) [37]. Additionally, the ultra-thin SiON layer in the highk metal gate technology can also be an ultra-thin SiO2 layer [38]. Based on this information, two Geant4 Monte Carlo simulation models were developed to examine the influence of The cross sections of 178 Hf interacting with eV-level neutrons are remarkably high, reaching 10 5 barns when compared to high-energy neutrons.…”
Section: Monte Carlo Simulationmentioning
confidence: 99%