Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials 2003
DOI: 10.7567/ssdm.2003.c-6-1
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High-modulus Porous MSQ Films for Cu/Low-k Integration (keff < 2.7)

K. Misawa1,
Shigenori Sone2,
Hamin Shin3
et al.
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