2013 IEEE International 3D Systems Integration Conference (3DIC) 2013
DOI: 10.1109/3dic.2013.6702353
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High performance 3D stacked DRAM processor architectures with micro-fluidic cooling

Abstract: In this work we consider new 3D IC processor architectures that become feasible only when aggressive cooling is used. In traditional air cooled 3D processors, heat removal is a big issue, and so designers often pursue low performance architectures in order to prevent thermal violations. We attempt to explore the new design space that is available to computer architects when micro-fluidic cooling is applied to the 3D chip. We show that adding more memory controllers to a 3D processor can offer the potential for… Show more

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Cited by 4 publications
(1 citation statement)
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“…With microfluidic cooling, these performance improvements became realizable, and new high performance architectures were achieved when cooling was designed considering the architecture. Results showed a 2.4× increase in average performance when comparing a 3D-stacked memory processor with and without micro-fluidic cooling [ 36 ]. The relationship between the performance of a 3D field programmable gate array (FPGA) and micro-channel heat sink design is very complicated and requires a comprehensive method that identifies the optimal design of 3D FPGAs subject to thermo-electrical constraints.…”
Section: Microfluidic Cooling Application In Specific Applicationmentioning
confidence: 99%
“…With microfluidic cooling, these performance improvements became realizable, and new high performance architectures were achieved when cooling was designed considering the architecture. Results showed a 2.4× increase in average performance when comparing a 3D-stacked memory processor with and without micro-fluidic cooling [ 36 ]. The relationship between the performance of a 3D field programmable gate array (FPGA) and micro-channel heat sink design is very complicated and requires a comprehensive method that identifies the optimal design of 3D FPGAs subject to thermo-electrical constraints.…”
Section: Microfluidic Cooling Application In Specific Applicationmentioning
confidence: 99%