2023
DOI: 10.1109/led.2022.3230705
|View full text |Cite
|
Sign up to set email alerts
|

High-Performance Hexagonal Tellurium Thin-Film Transistor Using Tellurium Oxide as a Crystallization Retarder

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
4
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(4 citation statements)
references
References 24 publications
0
4
0
Order By: Relevance
“…Nevertheless, this use is confined to small- and/or medium-area devices due to the intricate process flow, inhomogeneity from the grain boundary and challenges in upscaling mass production 16 . Extensive efforts have been directed towards exploring organic compounds 17 , 18 , metal halides 19 22 and low-dimensional nanomaterials 23 29 as p-type semiconductors for transistors. However, these materials show optimal performance only in crystallized form and they come with intrinsic limitations such as low stability, complex synthesis processes, large-area non-uniformity and a lack of industrial compatibility.…”
Section: Mainmentioning
confidence: 99%
“…Nevertheless, this use is confined to small- and/or medium-area devices due to the intricate process flow, inhomogeneity from the grain boundary and challenges in upscaling mass production 16 . Extensive efforts have been directed towards exploring organic compounds 17 , 18 , metal halides 19 22 and low-dimensional nanomaterials 23 29 as p-type semiconductors for transistors. However, these materials show optimal performance only in crystallized form and they come with intrinsic limitations such as low stability, complex synthesis processes, large-area non-uniformity and a lack of industrial compatibility.…”
Section: Mainmentioning
confidence: 99%
“…Moreover, achieving a well-crystalline-oriented Te film continuously grown with a few nm thickness over a 4-in. scale inevitably requires extraordinary or complex processes, such as evaporation at cryogenic temperature, , Al 2 O 3 encapsulation, , and chemical surface treatment, owing to its low crystallization temperature. ,, Overcoming these drawbacks is essential for the practical application and commercialization of Te-based pTFT to ensure processability.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, a new class of low-dimensional material, Te, has been intensively studied as a channel material for pTFT. Te atoms are covalently bonded with the two nearest atoms, constructing one-dimensional (1D) helical chains along the [001] direction. Each 1D helical chain is bonded by van der Waals interaction, forming hexagonal crystal arrays. , The band gap ( E g ) of the Te film can be continuously modulated from 0.35 to 1.3 eV with the reduction in film thickness due to the quantum confinement effect. , To achieve an E g over 0.7 eV, necessary for a TFT channel layer to ensure I off , the Te film must be less than 10 nm thick. However, uniformly depositing a few nanometer-thin Te film is technically challenging through conventional physical and chemical vapor deposition processes that use an island growth mechanism. Moreover, achieving a well-crystalline-oriented Te film continuously grown with a few nm thickness over a 4-in.…”
Section: Introductionmentioning
confidence: 99%
“…In addition to TMD materials, oxide semiconductor-based TFTs also have been developed as n-type TFTs, where recent works have shown the amorphous indium–gallium-zinc-oxide TFTs via low-temperature fabrication and other oxide semiconductor-based TFTs with solution-driven gate dielectrics. Considering that p-channel TFT is highly needed to implement complementary metal-oxide semiconductor logic circuits, a new class of p-type channels is required to develop high-performance devices with a low processing temperature. In recent years, tellurium (Te), a group IV quasi-2D material, has been considered as an advantageous p-type elemental semiconductor for various applications in nanoelectronics, optoelectronics, and energy harvesting devices. Te has an anisotropic structure, where the Te atoms are covalently bonded with two neighbor atoms in a triangular helical chain, which is stacked together in a hexagonal array through weak van der Waals forces; thus, the naturally terminated surfaces with no dangling bonds can form a clean interface, and high-performance Te-based devices with high hole mobility and air stability can be achieved. Based on the unique structure of Te that enables the implementation of high-performance p-type TFT, many groups have made efforts to develop growth techniques for high-quality Te thin films, including thermal evaporation-based deposition, , molecular beam epitaxy, , and the liquid-phase process of Te nanosheets. , Among those, the growth of Te thin films with maximum grain size was mostly achieved by evaporation at cryogenic temperature, according to the previous reports, , where the grain size of Te thin film and its carrier transport depend on the deposition temperature and nucleation during thermal evaporation. Thus, it is highly demanded to develop a new approach for the synthesis of Te thin films at room temperature to demonstrate the practical use of Te TFT with high performance and excellent stability.…”
Section: Introductionmentioning
confidence: 99%