“…In addition to TMD materials, oxide semiconductor-based TFTs also have been developed as n-type TFTs, where recent works have shown the amorphous indium–gallium-zinc-oxide TFTs via low-temperature fabrication and other oxide semiconductor-based TFTs with solution-driven gate dielectrics. – Considering that p-channel TFT is highly needed to implement complementary metal-oxide semiconductor logic circuits, a new class of p-type channels is required to develop high-performance devices with a low processing temperature. In recent years, tellurium (Te), a group IV quasi-2D material, has been considered as an advantageous p-type elemental semiconductor for various applications in nanoelectronics, optoelectronics, and energy harvesting devices. – Te has an anisotropic structure, where the Te atoms are covalently bonded with two neighbor atoms in a triangular helical chain, which is stacked together in a hexagonal array through weak van der Waals forces; thus, the naturally terminated surfaces with no dangling bonds can form a clean interface, and high-performance Te-based devices with high hole mobility and air stability can be achieved. – Based on the unique structure of Te that enables the implementation of high-performance p-type TFT, many groups have made efforts to develop growth techniques for high-quality Te thin films, including thermal evaporation-based deposition, , molecular beam epitaxy, , and the liquid-phase process of Te nanosheets. , Among those, the growth of Te thin films with maximum grain size was mostly achieved by evaporation at cryogenic temperature, according to the previous reports, , where the grain size of Te thin film and its carrier transport depend on the deposition temperature and nucleation during thermal evaporation. Thus, it is highly demanded to develop a new approach for the synthesis of Te thin films at room temperature to demonstrate the practical use of Te TFT with high performance and excellent stability.…”