High-Performance Inductors Using Capillary Based Fluidic Self-Assembly

Scott, Kenneth E.; Hirano, T.; Yang, Haw‐Ching; Singh, H.P.; Howe, Roger T.; Niknejad, Ali M.

doi:10.1109/jmems.2003.823234

Cited by 64 publications

(46 citation statements)

References 23 publications

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“…The need for postprocessing limits the applicability of these demonstrations when access to large areas and cost-effectiveness are critical factors. An alternative two-step approach relies on capillary forces of hexadecane for the primary alignment and then the capillary forces of a molten alloy to create the mechanical and electrical connections for placement of high-quality inductors (27). Self-assembly has also been used for 3D integration of freestanding millimeter-scale parts or folding of components placed on ribbons into electrical circuits (25).…”

mentioning

confidence: 99%

Self-assembled single-crystal silicon circuits on plastic

Stauth

Parviz

2006

Proc. Natl. Acad. Sci. U.S.A.

192

143

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We demonstrate the use of self-assembly for the integration of freestanding micrometer-scale components, including single-crystal, silicon field-effect transistors (FETs) and diffusion resistors, onto flexible plastic substrates. Preferential self-assembly of multiple microcomponent types onto a common platform is achieved through complementary shape recognition and aided by capillary, fluidic, and gravitational forces. We outline a microfabrication process that yields single-crystal, silicon FETs in a freestanding, powder-like collection for use with self-assembly. Demonstrations of self-assembled FETs on plastic include logic inverters and measured electron mobility of 592 cm 2 ͞V-s. Finally, we extend the self-assembly process to substrates each containing 10,000 binding sites and realize 97% self-assembly yield within 25 min for 100-m-sized elements. High-yield self-assembly of micrometer-scale functional devices as outlined here provides a powerful approach for production of macroelectronic systems.acroelectronics is an emerging area of interest in the semiconductor industry. Unlike the traditional pursuit in microelectronics to build smaller devices and achieve higher degrees of integration over small areas, macroelectronics aims to construct distributed active systems that cover large areas. Often, these systems are constructed on flexible substrates with multiple types of components and allow for distributed sensing and control. A number of applications are already under consideration for macroelectronics, including smart artificial skins (1), large-area phased-array radars (2), solar sails (3), flexible displays (4, 5), electronic paper (4), and distributed x-ray imagers (6). A candidate macrofabrication technology must be able integrate a large number of various functional components over areas exceeding the size of a typical semiconductor wafer in a cost-effective and time-efficient fashion.The substrate of choice for many macroelectronic applications is plastic. Flexible plastic substrates are thermally and chemically incompatible with conventional semiconductor fabrication processes. To incorporate electronic devices, a number of venues have been explored for low-temperature integration of semiconductors on plastics. The integration of semiconductor is followed by steps to build and interconnect functional devices. These material integration methods have demonstrated functional devices on plastic built from amorphous silicon (7), low-temperature polysilicon (8), and organic semiconductors (9, 10). Although in some applications low-performance devices are acceptable, in many applications, such as phased-array radar antennas or radio frequency tags, the integrated devices are required to perform at high frequencies with low power consumption. Devices built with the material integration methods outlined above suffer from low charge carrier mobility. Typical amorphous silicon transistors have electron mobility of 1 cm 2 ͞ V-s (11), low-temperature polysilicon transistors on plastic have electron mobilit...

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mentioning

confidence: 99%

Self-assembled single-crystal silicon circuits on plastic

Stauth

Parviz

2006

Proc. Natl. Acad. Sci. U.S.A.

192

143

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“…For example, Jacobs et al [7][8][9][10][11]14] all report yields greater than 95% for microscale parts self-assembling on binding sites composed of the same solder alloy used in this study. Similarly high yields are reported for self-assembly on binding sites composed of hydrophobic liquids [5,6]. In each of these cases, parts are pre-concentrated at locally planar binding site surfaces through the use of global forces from gravity, centrifugal rotation, the interfacial energy of immiscible liquids, or some combination of the three.…”

Section: Experimental Methodsmentioning

confidence: 59%

“…These forces may arise from insoluble polymers [3][4][5], non-polar liquids [6], liquid solders [7][8][9][10][11][12], gas-liquid interfaces [13], or a hierarchical combination of these techniques [14]. These methods are competitive with and produce similarly high yields as other approaches to parallel heterogeneous integration, such as parallel pick and place techniques based on elastomeric stamps [15][16][17][18].…”

Section: Open Accessmentioning

confidence: 99%

Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

et al. 2011

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Self-assembly is a promising technique to overcome fundamental limitations with integrating, packaging, and general handling of individual electronic-related components with characteristic lengths significantly smaller than 1 mm. Here we describe the use of magnetic and capillary forces to self-assemble 280 µm sized silicon building blocks into interconnected structures which approach a three-dimensional crystalline configuration. Integrated permanent magnet microstructures provided magnetic forces, while a low-melting-point solder alloy provided capillary forces. A finite element model of forces between the magnetic features demonstrated the utility of magnetic forces at this size scale. Despite a slight departure from designed dimensions in the actual fabricated parts, the combination of magnetic and capillary forces improved the assembly yield to 8%, over approximately 0.1% achieved previously with capillary forces alone.

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“…In the first, proposed by Scott et al [7], the substrates were simply set on a hot plate (HP) and reflowed. We kept the temperature of the hot plate at 95°C for 3' to let all residual water evaporate from dies and substrate.…”

Section: Methodsmentioning

confidence: 99%