Atomic
layer deposition (ALD) is a promising deposition method
to precisely control the thickness and metal composition of oxide
semiconductors, making them attractive materials for use in thin-film
transistors because of their high mobility and stability. However,
multicomponent deposition using ALD is difficult to control without
understanding the growth mechanisms of the precursors and reactants.
Thus, the adsorption and surface reactivity of various precursors
must be investigated. In this study, InGaO (IGO) semiconductors were
deposited by plasma-enhanced atomic layer deposition (PEALD) using
two sets of In and Ga precursors. The first set of precursors consisted
of In(CH3)3[CH3OCH2CH2NHtBu] (TMION) and Ga(CH3)3[CH3OCH2CH2NHtBu]) (TMGON),
denoted as TM-IGO; the other set of precursors was (CH3)2In(CH2)3N(CH3)2 (DADI) and (CH3)3Ga (TMGa), denoted
as DT-IGO. We varied the number of InO subcycles between 3 and 19
to control the chemical composition of the ALD-processed films. The
indium compositions of TM-IGO and DT-IGO thin films increased as the
InO subcycles increased. However, the indium/gallium metal ratios
of TM-IGO and DT-IGO were quite different, despite having the same
InO subcycles. The steric hindrance of the precursors and different
densities of the adsorption sites contributed to the different TM-IGO
and DT-IGO metal ratios. The electrical properties of the precursors,
such as Hall characteristics and device parameters of the thin-film
transistors, were also different, even though the same deposition
process was used. These differences might have resulted from the growth
behavior, anion/cation ratios, and binding states of the IGO thin
films.